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搭载 8 个和 4 个节点的高级多节点 4U 双线处理架构 创新型双线处理架构,可最大限度提高可维护性和可靠性 FatTwin® 架构提供灵活性和系统可访问性,可满足独特的数据中心需求 独特的半宽节点可为每个机架单元提供 2 个节点,以便使用冗余电源实现左右节点模块化,从而最大限度提高可靠性 采用无工具设计的高度模块化多节点系统 每个节点支持两个第三代智能英特尔至强可扩展处理器,可提升性能
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英特尔® Ice Lake-D 4/8/10 核处理器 多达 4 个 DDR4 3200Mhz 通道,4 个 RDIMM/LRDIMM 插槽,容量高达 256 GB 1 个 IPMI 专用 LAN 端口;2 个 25G SFP28 端口;4 个 GbE 端口;2 个 USB 3.0 type A 端口;3 个 M.2 (M/B/E-Key) 端口 2 个 2.5 英寸 SATA 固态硬盘 应用:零售、防火墙、网关、uCPE。
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边缘计算让云和物理世界能够融为一体,提供下一代数字就绪基础架构,从而加快上市速度,并在商店、餐厅和分支机构提供数字化沉浸式体验。Supermicro/Reliant 边缘计算平台是一个面向零售业和酒店业的预配置强化平台,包括用于虚拟化、容器化、监控、敏感数据安全性和集中控制的领先工具,可以管理可扩展基础架构,支持传统应用和新一代应用、物联网、多种操作系统以及分散在数千个地理位置的设备。
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英特尔® 至强® D Ice Lake 4/8/16/20 核处理器,多达 4 个 DDR4 3200 Mhz 通道,4 个 RDIMM/LRDIMM 插槽,容量高达 512 GB 1 个 IPMI 专用 LAN 端口;4 个 GbE 端口;2 个 10GbE 端口;2 个 25G SFP28 端口 2 个 USB 3.0 Type A 端口;1 个 M.2 M-Key SATA/PCI-E 3.0 x4 端口,22802 SATA/U.2 2.5 英寸驱动器,主板:X12SDV-4C/8C/16C/20C-SPT8F (7.5 英寸 x 8.5 英寸) 1U 机箱:515M-R804/515M-R601,17.2 英寸(宽度)x 15.7 英寸(深度)x 1.7 英寸(高度)(437x399x43mm)。应用程序:网络应用程序、防火墙、uCPE、电信应用程序。
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Supermicro’s Intelligent Retail Edge is a complete edge computing platform which provides a reliable, flexible, and secure infrastructure solution for retailers, restaurants, and hotels. As local compute across distributed locations becomes increasingly critical for retail operations, these platforms must be deployed, managed, maintained, and secured on a mass scale.
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Supermicro offers 100% cloud-based edge management total solution. The solution connects Apps to Network, Cloud, Data Center or other Edge Gateway through a platform providing a consistent, automated, hardware agnostic, and secure operating model for mass-deployed edge devices and applications. Customers can benefit from highly efficient management by one-click for hundreds of units full stack provisioning.
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Cost-Effective 2U 4-Node Rackmount ServerTwinPro® systems are designed for simplified deployment and maintenance, and assembled with the highest quality to ensure continuous operation even at maximum capacity.Optimized thermal design for maximum power efficiencyDual socket supported. TDP up to 185W, 2 UPI16 DIMM slots. Up to 4TB ECC RDIMM/LRDIMM DDR4-3200MHzSupport up to 6 hot-swappable SAS/SATA and 2 internal M.2 NVMe SSDs per nodeOnboard dual 10GbE RJ45 ports with Intel® X710-AT2 controller2 PCI-E 4.0 x16 LP expansion slots and 1 PCI-E 4.0 x8 (M.2)2 Redundant 2200W Titanium Level (96%) power supplies
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Best-in-class Performance and Flexibility Rackmount ServerUltimate Configurability for Enterprise and Telco ApplicationsThe all-new Hyper series represents the latest generation of Supermicro rackmount servers built with the highest performance features to take on the most demanding workloads along with the storage & I/O flexibility that provide a custom fit to your application needs.Telco optimized configurations include short depth, carrier grade (NEBS Level 3) Hyper-E servers with AC & DC power options.Maintenance-friendly design innovations to eliminate the need for tools when servicing the system.High performance 1U & 2U systems with rear I/O and front I/O configurations to meet today’s data center requirementsDual 3rd Gen Intel® Xeon® Scalable processors up to 270W and 32 DIMM slots for maximum memory capacityLightning-fast storage with the latest generation PCI-E 4.0 NVMe SSDs and networking flexibility with AIOM (OCP 3.0 compliant) NIC supportTool-less system design features intended to simplify field serviceability and lower maintenance time
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Key Features Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual LAN with Intel® Ethernet Controller I210-IT 1 M.2 B-Key 2242/3042, 1 Half size Mini-PCI-E 1 HDMI, 1 48-bit LVDS, Intel® HD Graphic 2 independent displays Extension I/O (1 DP/HDMI, 2 PCI-E x1, 2 USB2.0, LPC, SATA, SMBus, Power) 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers), 2 COM ports (via headers) Supports 12V DC power input Wide temperature support from -30°C to 75°C The A2SAP-H/-E/-L motherboard provides powerful graphics and increased media processing performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a-Chip) processor, the A2SAP-H/-E/-L delivers more computing power for faster memory speeds and bandwidth while maintaining energy efficiency. Utilizing Intel® TCC (Time Coordinated Computing) Technology, the A2SAP-H/-E/-L resolves latency issues in applications and improves determinism across connected devices. The motherboard features advanced technologies such as Intel® Virtualization to improve security and reliability of systems, and Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and high-speed connectivity.
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Key Features Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual GbE LAN with Intel® i210-AT 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E, 1 SATA 3.0 1 HDMI, 1 VGA, 1 48-bit LVDS, Intel® HD Graphic 3 independent displays 1 USB 3.1 Gen2 Type-C port, 2 USB 3.0 ports, 4 USB 2.0 ports, 4 COM ports, 1 SATA 3.0, 8-bit GPIO, SMBus Supports on board TPM 2.0 Supports 12V DC power input The A2SAN and X11SAN motherboard provides powerful graphics and increased media processing performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a-Chip) processor, the A2SAN and X11SAN delivers more computing power for faster memory speeds and bandwidth while maintaining energy efficiency. Utilizing Intel® TCC (Time Coordinated Computing) Technology, the A2SAN-H/-E/-L and X11SAN resolves latency issues in applications and improves determinism across connected devices. The motherboard features advanced technologies such as Intel® Virtualization to improve security and reliability of systems, and Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and high-speed connectivity.