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COM Express Type 7 基础模块基于英特尔® Ice Lake-D 至强® 处理器,可适应宽温度范围,适用于工业环境;32 PCIe 高速通道,英特尔® DL boost 实时平台实现 AI 功能。支持高达 128 GB DDR4 2666MT/s 内存。
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COM Express Type 6 紧凑型模块基于第 12 代英特尔® 酷睿™ 处理器家族 英特尔® 混合设计将性能内核与高效内核相结合 英特尔® 锐炬® Xe 显卡架构,具有多达 96 个 EUs PCI Express Gen 4 | USB 3.2AI 加速与英特尔® 深度学习加速 (VNNI) 嵌入式使用条件 SKU。
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conga-LEK(Lan 启用套件)是夹层卡,可与 conga-HPC/Eval-Server 评估载板一起使用。这些扩展卡使用户能够无缝地评估不同的以太网配置选项。LEK 至高可提供 100 Gb 的总吞吐量,并支持 SFP28 和 QSFP28 等现代收发器外形。
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COM HPC 客户端尺寸 A 模块基于英特尔®(原为“Tiger Lake”)-UP3 高性能和低功耗英特尔® 酷睿™ 处理器系列外形 COM HPC,尺寸 A(95 x 120 毫米),客户端连接器引脚分配 DRAM 多达 2 个 SO-DIMM 插槽,用于 DDR4 内存模块,每个最多 32 GByte(总共 64 GByte),具有 3200 MT/sECC 和非 ECC 支持的显卡集成 Xe(第 12 代)显卡引擎,多达 96 个 EU(执行单元)|支持 4 个独立显示单元(4x 4k/2x 8K)|具有高达 2 Vdbox 的增强型媒体 (AV1/12b) |具有 DPHY2.1 的下一代 IPU6 | HDMI 2.0/2.1 | DP 1.4 Display3x DP/HDMI/DP++ | 1x eDPEthernet2x 2,5 GbE TSN 以太网,通过英特尔® i225I/O 接口 4x PCIe Gen4 | 8x PCIe Gen32x USB 4.0 | 2x USB 3.22x SATA III (6Gb/s) | SPI | 2x UART | 12x GPIO | 2x MIPI-CSIAudio1x I2S | 2x Sound wirecongatec 主板控制器多级看门狗|非易失性用户数据存储 |制造和电路板信息 | 电路板统计 I²C 总线(快速模式,400 kHz,多主机)|断电控制 |硬件运行状况监测 | POST 代码重定向 嵌入式 BIOS 功能 OEM 定制 |闪存更新 |基于 AMI Aptio UEFI SecurityTrusted 平台模块 (TPM 2.0) 电源管理 ACPI 5.0,带电池支持,尺寸 95 x 120 毫米
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COM-HPC 客户端 C 尺寸模块基于第 12 代英特尔® 酷睿™ 嵌入式桌面处理器 英特尔® 混合设计将 P-core(性能核)与 E-core(能效核)相结合 由 Xe 架构驱动的英特尔® 超核芯显卡 770 PCI Express Gen 4/5 | USB 3.2 Gen 2x2 基于英特尔® 深度学习的 AI 加速 嵌入式使用条件 SKU
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COM-HPC 客户端 Size A 模块基于第 12 代英特尔® 酷睿™ 嵌入式移动处理器 英特尔® 混合设计将性能内核与高效内核相结合 英特尔® 锐炬® Xe 显卡架构,具有多达 96 个 EUs PCI Express Gen 4 | USB 4AI 加速与英特尔® 深度学习加速 (VNNI) 嵌入式使用条件 SKU。
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Formfactor Qseven Form Factor Rev. 2.0 compliant | 70x70 mmCPUIntel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPIntel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPFeaturesDRAM: Dual Channel | up to 8GB onboard DDR3L with 1867 MT/sChipset: Integrated in SoCEthernet: Intel® I210 (Industrial) / I211 (Commercial) Gigabit Ethernet ControllerI/O Interfaces: 3x PCIe Gen2 | 1x USB 3.0/2.0 | 5x USB 2.0 | 2x SATA3 | SDv3 | LPC Bus | SMBus | I2C Bus | UARTMass Storage: eMMC 5.0 onboard flash up to 64 GByteSound: Intel® High Definition Audio (Intel® HD Audio)Graphics: Intel® Gen 9 LP Graphics supporting DirectX 12 | OpenGL 4.3 | OpenCL 2.0 | OpenGL ES 3.0 | HW accelerated video decoding HEVC/H.264/MVC/MPEG2/VP9/VC-1/WMV9/MJPEG and encoding HEVC/H.264/MVC/VP8/MJPEG | Content protection using PAVP 2.0 and HDCP 1.4/2.2LVDS: 18/24-bit Single/Dual Channel LVDS Interface, resolutions up to 1920X1200@60Hz | VESA standard or JEIDA data mapping Automatic Panel Detection via EDID/EPI | shared with eDP 1.3 supporting up to 3840x2160@60 Hz (option)DisplayPort Interface (DDI): DisplayPort 1.2 up to 4096×2160@60Hz or HDMI 1.4b up to 3840×2160@30HzMIPI-CSI: 1x MIPI-CSI x4 and 1x MIPI-CSI x2congatec Board controller: Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics I²C bus (fast mode | 400 kHz | multi master) | power loss controlEmbedded BIOS Features: AMI Aptio® UEFI 2.x firmware | 8 MByte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control Display Auto Detection | Backlight Control | Flash UpdatePower Management: ACPI 5 .0 compliant | Smart Battery ManagementOperating Systems: Microsoft® Windows 10 | LinuxPower Consumption: Typ. application 6W...12WTemperature: Commercial : Operating: 0 to +60°C Storage: -20 to +70°CIndustrial: Operating: -40 to +85°C Storage: -40 to +85°CHumidity: Operating: 10 to 90% r. H. non cond.Storage: 5 to 95% r. H. non cond.Size: 70 x 70 mm (2¾” x 2¾”)
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FormfactorSMARC Specification 2.0 | 82x50 mmCPUIntel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPIntel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPFeaturesDRAM: up to 8GB onboard LPDDR4 with 2400MT/sChipset: Integrated in SoCEthernet: up to 2x Intel® I210 (Industrial) /I211 (Commercial) Gigabit Ethernet Controller with SDP support | 2x Real Time TriggerI/O Interfaces: 2x USB3.0 | 4x USB2.0 | 1x SATA3 | 1x SDIO | up to 4x PCIe Gen2 | 2x I²C Bus | 2x SPI I 4x UART | optional M.2 1216 WiFi module (soldered down)Mass Storage: eMMC 5.0 onboard flash up to 64 GByteSound: Intel® High Definition Audio (Intel® HD Audio) Integrated Audio DSP with Intel® Smart Sound TechnologyGraphics: Intel® Gen 9 HD Graphics with support for DirectX 12 | OpenGL 4.3 | OpenCL 2.0 | OpenGL ES 3.0 | MPEG2 full HW acceleration with H.265/HEVC decoding and encoding | MVC and 2x independent display support in 4K | VP9 | PAVP 2.0 | HDCP 1.4 (wired), HDCP 2.0 (wireless)LVDS: Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 @60Hz | shared with eDP or 2x MIPI-DSI x4 (option)DisplayPort Interface (DDI): DisplayPort 1.2 up to 4096x2160px or HDMI 1.4b up to 3840x2160pxMIPI-CSI: 1x MIPI-CSI x4 and 1x MIPI-CSI x2congatec Board controller: Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics I²C bus (fast mode | 400 kHz | multi master) | power loss controlEmbedded BIOS Features: AMI Aptio® UEFI 2.x firmware | 8 MByte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control Display Auto Detection | Backlight Control | Flash UpdatePower Management: ACPI 5 .0 compliant | Smart Battery ManagementOperating Systems: Microsoft® Windows 10 | Microsoft® Windows IoT Core | Linux | Android 6.0 | VxWorks 7.0Power Consumption: Typ. application: tbd. | see manual for full detailsTemperature:Commercial : Operating: 0 to +60°C Storage: -20 to +80°CIndustrial: Operating: -40 to +85°C Storage: -40 to +70°CHumidity: Operating: 10 to 90% r. H. non cond. Storage: 50 to 95% r. H. non cond.Size: 82 x 50 mm (3,23” x 1,97”)
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FormfactorCOM Express BasicCPUIntel® Xeon® D1577 (16 x 1.3 / 2.1 GHz, 25MB cache, 45 W)Intel® Xeon® D1548 (8 x 2.0 / 2.6 GHz, 12MB cache, 45 W)Intel® Xeon® D1527 (4 x 2.2 / 2.7 GHz, 6MB cache, 35 W)Intel® Pentium™ D1509 (2 x 1.5 GHz, 3MB cache, 19 W)Intel® Pentium™ D1508 (2 x 2.2 / 2.6 GHz, 3MB cache, 25 W )Intel® Xeon® D1559 (12 x 1.5 / 2.1 GHz, 18MB cache, 45 W)Intel® Xeon® D1539 (8 x 1.6 / 2.2 GHz, 12MB cache, 35 W)Intel® Xeon® D1529 (4 x 1.3 GHz, 6MB cache, 20 W)Intel® Pentium™ D1519 (4 x 1.5 / 2.1 GHz, 6MB cache, 25 W)DRAMup to 3 SO-DIMM sockets for DDR4 memory modules up to 16 GByte each (48 GByte total) with 2400 MT/s | ECC and non-ECC supportedChipsetIntegrated in SoCEthernet1x Intel I210AT /IT Gigabit Ethernet Controller | 2x 10GbE with KR interface support - the 10GbE PHY must be implemented on the carrier boardI/O Interfaces24 x PCI Express GEN 3.0 lanes8 x PCI Express 2.04 x USB 2.02 x SATA IIILPC busSPII²C bus2 x UARTcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesOEM LogoOEM CMOS DefaultsFlash UpdateAMI Aptio UEFISecurityTrusted Platform Module (TPM) optional. Hash and RSA algorithms, key lengths up to 2,048 bits, real random number generatorPower ManagementACPI 5 .0 compliant, Smart Battery ManagementOperating SystemsMicrosoft® Windows 10 EnterpriseMicrosoft® Windows® 8.1Microsoft® Windows® 7Microsoft® Windows Server 2016Fedora 22Ubuntu 14.10CentOS 6.6 & 7.1FreeBSD 10.3 & 11VMwareMicrosoft® Windows Server 2012 R2Microsoft® Windows Server 2012Microsoft® Windows Server 2008 R2 SP1RHEL 6.6 & 7.1SuSE 11 SP4 & 12 SP1Yocto v.2.0 Kernel 4.1Wind River VxWorks 7ESXiTemperatureStandardOperating: 0 to +60°CStorage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size95 x 125 mm (3.74" x 4.92")
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Industrial Thin Mini-ITX based on 5th Generation Intel® Atom™, Intel® Celeron® and Pentium® ProcessorsIntel® 5th Gen. Atom™, Celeron® and Pentium® ProcessorsLow Power CPUs 6 to 12 Watt TDPEnhanced Intel® HD Graphics Generation 9Long life components for 24/7 embedded useExtended Temperature variants
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FormfactorCOM Express® Compact | (95 x 95 mm) | Type 6 Connector LayoutCPU Intel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPIntel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPFeaturesDRAM: 2 SO-DIMM sockets for DDR3L memory modules up to 8 GByte with 1867 MT/s | Dual channel memory interface for increased graphics performanceChipset: Integrated in SoCEthernet: Intel I210 (Industrial) /I211 (Commercial) Gigabit Ethernet Controller with SDP supportI/O Interfaces: 5x PCIe x1 | 4x USB 3.0 (XHCI) | 8x USB 2.0 (EHCI) | 2x SATA III | LPC | SPI | I²C bus (fast mode 400 kHz | multi-master) | SDIO 2x UART (RX/TX)s | 2x MIPI-CSIMass Storage: eMMC 5.0 onboard flash up to 64 GByteSound: Digital High Definition Audio InterfaceGraphics: Intel® HD Graphics Gen 9 | PAVP 2.0 | H.265/HEVC | VP9 | OpenCL 2.0 | OpenGL 4.3 | OpenGL ES 3.0 | DirectX12 | HDCP1.4LVDS: Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200@60Hz.Digital Display Interface (DDI): Up to 2x DisplayPort 1.2a or 2x HDMI 1.4b (max. 3840x2160 @ 30Hz) | 1x eDP 1.3 (optional)congatec Board Controller: Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup I²C bus (fast mode, 400 kHz, multi-master) | Power Loss ControlEmbedded BIOS Features: OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update | based on AMI Aptio UEFISecurity: Trusted Platform Module (TPM) optional. Hash and RSA algorithms | key lengths up to 2048 bits | real random number generatorPower Management: ACPI 5.0 with battery supportOperating Systems: Microsoft® Windows 10 | LinuxPower Consumption: see user’s guide for full details | CMOS Battery BackupTemperature:Commercial : Operating: 0 to +60°C Storage: -20 to +80°CIndustrial: Operating: -40 to +85°C Storage: -20 to +80°CHumidity: Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond.Size: 95 x 95 mm (3.74” x 3.74”)
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支持英特尔® 傲腾™ 内存技术 外形:Mini ITX;CPU:英特尔® 酷睿™ i5-7300U(2 x 2.6/3.5 GHz,3MB 缓存,15W)、英特尔® 酷睿™ i3-7100U(2 x 2.4 GHz, 3MB 缓存,15W)、英特尔® 赛扬® 3965U(2 x 2.2 GHz,2MB 缓存,15W)、英特尔® 酷睿™ i7-7600U(2 x 2.8/3.9 GHz,4MB 缓存,15W);DRAM:2 个 SO DIMM 插槽(双通道 DDR4,高达 2133 MT/s),最高 2x 16GB;芯片组:集成在 SoC 中;以太网:两个 LAN Gb/100 Mb/10 Mb 端口;1 个英特尔® 千兆位以太网 PHY i219LM(支持 AMT);1 个英特尔® 千兆位以太网控制器 i211(i210 可选);内部连接器:1 个 PCIe x4 插槽 (gen3)、1 个全/半尺寸 Mini PCIe 插槽;M.2 key B 2242/3042 连接器(2 个 PCIe 通道用于支持英特尔® 傲腾™ 内存);3 个 SATA (6G),一个与 M.2 共享,1 个 SATA 电源,4 个 USB 2.0,1 个 LVDS(2x24 位),1 个嵌入式 DisplayPort (x4),1 个背光(电源,控制),1 个监视器关闭,1 个环绕声,1 个前面板高清音频,1 个数字麦克风或 S/PDIF,1 个内部立体声扬声器,2 个串行端口 COM2(可以选择作为 ccTALK),1 个功能连接器 - congatec 自定义(8 位通用 I/O);集成传感器中枢的连接器:1 个前面板(电源开关、LED、重置),1 个入侵(打开机壳),1 个风扇 CPU,1 个风扇系统,1 个内部电源 (12-24V),1 个 CEC,1 个 microSIM 卡插槽,1 个 microSD 卡插槽,1 个可选的电源插座信号 + 电源 (SBM3),1 个 I²C 总线;外部连接器:2 个 DisplayPort dp++音频输入线路输出,2 个 LAN RJ45,4 个 USB 3.0/2.0,1 个直流输入(外部输入)12-24 V;Vcongatec 主板控制器:多阶段监视器 | 非易失性用户数据存储 | 制造和主板信息 | 主板统计数据 | LVDS 背光控制 I²C 总线(快速模式,400 kHz,多主设备)| 断电控制;嵌入式 BIOS 功能:AMI Aptio UEFI;SM-BIOS:BIOS 更新开机画面;静默启动:普通硬盘密码;安全性:conga-IC175 可以选择装配独立的“可信平台模块 2.0”,它能够计算高效散列,RSA 算法的密钥长度高达 2048 位,并包括真正的随机数生成器;电源管理 | ACPI S3/S4 DeepSx | S5 按时唤醒 | 电源 12-24 V | 2 个风扇(CPU/系统)受到监视和控制;操作系统:Microsoft® Windows 10(仅限 64 位)、Microsoft® Windows 10 IoT Enterprise(仅限 64 位),Linux;功耗:请参阅用户指南了解详情;温度:工作:0 至 +60°C,存储:-20 至 +70°C;湿度:工作:10 至 90% RH(无冷凝);尺寸:170 x 170 毫米(6.7 英寸 x 6.7 英寸)
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Formfactor Pico-ITX Singleboard Computer CPU Intel® Atom™ x7-E3950 2.00 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 12W TDPIntel® Atom™ x5-E3940 1.80 GHz (Burst) | 1.6 GHz Clock Quad Core L2 cache 2MB 9W TDPIntel® Atom™ x5-E3930 1.80 GHz (Burst) | 1.3 GHz Clock Dual Core L2 cache 1MB 6.5W TDPIntel® Pentium® N4200 2.50 GHz (Burst) | 1.1 GHz Clock Quad Core L2 cache 2MB 6W TDPIntel® Celeron® N3350 2.40 GHz (Burst) | 1.1 GHz Clock Dual Core L2 cache 1MB 6W TDPDRAMMemory up to 4 Channels onboard LPDDR4 (V1.1) with up to 2400 MT/s | max. 8 GBChipsetIntegrated in SoCEthernet2x LAN Gbit / 100 Mbit / 10 Mbit | Intel Gigabit Ethernet i211 controller (i210 for industrial temperature)SoundHigh Definition Audio Interface | Cirrus Logic CS4207GraphicsIntel® Gen 9 HD Graphics with support for DirectX12 | OpenGL 4.3 | OpenCL 2.0 | OpenGLES 3.x | MPEG2 full HW acceleration with H.265/HEVC decoding and H.264 encoding | VP9 | PAVP 3.x | HDCP 1.4 | MVC and 2x independent display support in 4K (3840 x 2160 px) @30 Hz or WQXGA (2560 x 1600 px) @60 HzGraphic Interfaces1x 18/24-bit Single/Dual Channel LVDS Interface (via eDP to LVDS converter PTN3460) | 1x DisplayPort DP++ | resolution up 1920x1200 with 60Hz up to 4096x2160 @ 60Hz with eDPInternal Connectors 1x miniPCIe or mSATA full size | 1x SATA (6G) (with auxiliary +5V power connector for 2.5" HDD)2x USB 2.0 | 1x LVDS 2x24bit | 1x Backlight power connector | 1x Line Out | 1xMic In | 1x S/PDIF Out | 1x Power In (+12V) 2x COM (RS232 / RS-485 / RS422) | 1x Fan Connector | 3x Feature Connector | micro SD Card | MIPI-CSI 2.0External Connectors(Frontpanel)1x DisplayPort DP++ | 2x LAN RJ45 | 1x USB 3.0 Type C (with PD and DP++) | 2x USB 3.0 | 1x DC-In (only for commercial variants)congatec embedded ControllerMulti-Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup I²C bus (fast mode | 400 kHz | multi-master) | Power Loss ControlEmbedded BIOSAMI Aptio® 2.X (UEFI) BIOS; SM-BIOS | BIOS Update | Logo Boot | Quiet Boot | HDD PasswordPower Specification Power Supply 12V | RTC batteryOperating SystemsMicrosoft® Windows 10 | Microsoft® Windows 10 IoT | Linux (Wind River, Yocto) | Android | Wind River VxWorksOperating Temperature:Operating: Commercial: 0 .. +60°C Storage: Commercial: -40 .. +70°CIndustrial: -40 + 85°C Industrial: -40 + 85°CHumidity Operating:Operating: 10 - 90% r. H. | Storage: 5 - 95% r.H.Size 100 x 72 mm (3.9” x 2,8”)
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Codename "Denverton"COM Express Type 7 Basic module based on the latest Intel Atom® C3000 processor series FormfactorCOM Express BasicCPUIntel® Atom™ C3958 (16 x 2.0 GHz, 16MB cache , 31 W)Intel® Atom™ C3858 (12x 2.0 GHz , 12MB cache, 25W)Intel® Atom™ C3758 (8x 2.2 GHz, 16MB cache, 25W)Intel® Atom™ C3558 (4x 2.2 GHz, 8MB cache, 16W)Intel® Atom™ C3538 (4x 2.1 GHz, 8MB cache, 15W)Intel® Atom™ C3808 (12x 2.0 GHz, 12MB cache, 24W)Intel® Atom™ C3708 (8x 1.7 GHz, 16MB cache, 17W )Intel® Atom™ C3508 (4x 1.5 GHz, 8MB cache, 11)DRAMup to 3 SO-DIMM sockets for DDR4 memory modules up to 16 GByte each (48 GByte total) with 2400 MT/s | ECC and non-ECC supportedChipsetIntegrated in SoCEthernet4x 10GbE with KR interface supportI/O Interfaces12 x PCI Express GEN 3.0 lanes8 x PCIe Gen22 x USB 3.04 x USB 2.02 x SATA IIILPC busSPI2 x UARTSM-Buscongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesOEM LogoOEM CMOS DefaultsFlash UpdateAMI Aptio UEFISecurityTrusted Platform Module (TPM) optional. Hash and RSA algorithms, key lengths up to 2,048 bits, real random number generatorPower ManagementACPI 5 .0 compliant, Smart Battery ManagementOperating SystemsMicrosoft® Windows 10 EnterpriseMicrosoft® Windows® 8.1Microsoft® Windows® 7Microsoft® Windows Server 2016Fedora 22Ubuntu 14.10CentOS 6.6 & 7.1FreeBSD 10.3 & 11VMwareMicrosoft® Windows Server 2012 R2Microsoft® Windows Server 2012Microsoft® Windows Server 2008 R2 SP1RHEL 6.6 & 7.1SuSE 11 SP4 & 12 SP1Yocto v.2.0 Kernel 4.1Wind River VxWorks 7ESXiRTS Hypervisor
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FormfactorCOM Express MiniCPUIntel® Atom™ x7-E3950 (4 x 1.6 / 2.0 GHz, 2MB L2 cache, 12W)Intel® Atom™ x5-E3940 (4 x 1.6 / 1.8 GHz, L2 cache 2MB, 9W)Intel® Atom™ x5-E3930 (2 x 1.3 / 1.8 GHz, L2 cache 1MB, 6.5W)Intel® Pentium® N4200 (4 x 1.1 / 2.5 GHz, L2 cache 2MB, 6W)Intel® Celeron® N3350 (2 x 1.1 / 2.4 GHz, L2 cache 1MB, 6W)DRAMDual channel onboard DDR3L memory support for up to 8 GByte at 1866MT/sChipsetIntegrated in SoCEthernetIntel® I210 (Industrial) / I211 (Commercial) Gigabit Ethernet ControllerI/O Interfaces4 x PCIe Gen22 x USB 3.06 x USB 2.02 x SATA3SDIOLPC busSM-BusI²C bus2 x UARTSoundHigh Definition Audio InterfaceGraphicsIntel® HD Graphics Gen 9 | PAVP 2.0 | H.265/HEVC | VP9 | OpenCL 2.0 | OpenGL 4.3 | OpenGL ES 3.0 | DirectX12 | HDCP1.4congatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI AptioV® UEFI 2.x firmware8 MByte serial SPI firmware flashOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash UpdateSecurityInfineon’s Trusted Platform Module (TPM 2.0/1.2) SLB 9665/9660 optionPower ManagementACPI 5 .0 compliant, Smart Battery ManagementOperating SystemsMicrosoft® Windows 10 EnterpriseMicrosoft® Windows IoT CoreLinuxAndroidPower ConsumptionTyp. application <10 WattTyp. application <10 W @ 5 V, CMOS Battery BackupTemperatureStandard Operating: 0 to +60°CStorage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size55 x 84 mm (2.17" x 3.31")
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Ready for Intel® Optane™ memory technology FormfactorCOM Express CompactCPUIntel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)Intel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)DRAM2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32 GByte dual channelChipsetIntegrated PCH-LPEthernetIntel® i219-LM GbE LAN Controller with AMT 11.6 supportI/O Interfaces8 x PCI Express GEN 3.0 lanesIntel® Optane™ memory can be connected via PCI Express Gen 3.03 x Serial ATA® Gen 3 (can be configured as RAID)4 x USB 3.0 (XHCI)8 x USB 2.0 (XHCI)LPC bus (no DMA)I²C bus (fast mode, 400 kHz, multi-master) 2 x UARTSoundDigital High Definition Audio Interface with support for multiple audio codecsGraphicsIntel® Gen9 HD Graphics Engine OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encodingcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI AptioV® UEFI 2.x firmware8/16 MByte serial SPI firmware flashSecurityThe conga-TC175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.Power ManagementACPI 4.0 with battery supportOperating SystemsMicrosoft® Windows 10 (64bit only)Fedora 24UbuntuSuSeRed Hat EnterpriseYocto Project v2.2Chromium 2Wind River VxWorksMicrosoft® Windows 10 IoT Enterprise (64bit only)Power ConsumptionSee User's Guide for full detailsTemperatureStandardOperating: 0 to +60°CStorage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces2x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPISize95 x 95 mm (3,74" x 3,74")
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conga-TS370COM Express Type 6 Basic module based on the latest Intel® processor series (formerly Coffee Lake) 8th Generation Intel® Core™ processorwith up to 6 CoresIntel® Xeon® processors for data center applicationsSupport for USB 3.1 Gen2 with 10Gb/sIntel® Optane™ memory supportECC memory supportUp to 32 GByte dual channel DDR4 memory
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支持英特尔® 傲腾™ 内存技术 外形:COM Express Basic;CPU:英特尔® 酷睿™ i7-7820EQ(4 x 3.0/3.7 GHz,8MB 缓存,45W)、英特尔® 酷睿™ i5-7440EQ(4 x 2.9/3.6 GHz,6MB 缓存,45W)、英特尔® 酷睿™ i5-7442EQ(4 x 2.1/2.9 GHz,6MB 缓存,25W)、英特尔® 酷睿™ i3-7100E(2 x 2.9 GHz,3MB 缓存,35W)、英特尔® 酷睿™ i3-7102E(2 x 2.1 GHz,3MB 缓存,25W)、英特尔® 至强® E3-1505M V6(4 x 3.0/4.0 GHz,8MB 缓存,45W)、英特尔® 至强® E3-1505L V6(4 x 2.2/3.0 GHz,8MB 缓存,25W);DRAM2 插槽:SO-DIMM DDR4,高达 2400 MT/s 和 32 GB 双通道,ECC 支持可选;芯片组:移动式英特尔® 100 系列芯片组;以太网:英特尔® i219-LM GbE LAN 控制器,支持 AMT 11.6;I/O 接口:8 个 PCI Express GEN 3.0 通道;英特尔® 傲腾™ 内存可通过 PCI Express Gen 3.0 建立连接;4 个串行 ATA Gen 3、4 个 USB 3.0 (XHCI)、8 个 USB 2.0 (XHCI)、1 个 PEG x16 Gen 3 端口;LPC 总线:I²C 总线(快速模式,400 kHz,多主设备),2 条 UART 总线;声频:数字高清音频接口,支持多个音频编解码;显卡:支持英特尔® Gen9 HD 图形引擎 OpenCL 2.1、OpenGL 5.0 和 DirectX12(适用于 Windows 10)| 最多 3 个独立显示器:HDMI 1.4a/DisplayPort 1.2/eDP 1.3 | 高性能硬件 MPEG-2 解码 | 支持 WMV9 (VC-1) 和 H.265 (HEVC),蓝光支持 @ 40 MBit/s | HEVC,VP9 和 VDENC 编码;Congatec 主板控制器:多阶段监视器 | 非易失性用户数据存储 | 制造和主板信息 | 主板统计数据 | LVDS 背光控制 I²C 总线(快速模式,400 kHz,多主设备)| 断电控制;嵌入式 BIOS 功能:AMI AptioV® UEFI 2.x 固件,8/16 MB 系列 SPI 固件闪存;安全性:conga-TS175 可以选择装配独立的“可信平台模块”(TPM 1.2 / 2.0);电源管理:配备电池架的 ACPI 4.0;操作系统:Microsoft® Windows 10(仅限 64 位)、Microsoft® Windows 10 IoT Enterprise(仅限 64 位);Linux:Fedora 24、Ubuntu;SuSe:Red Hat Enterprise、Yocto Project v2.2、Chromium 2、Wind River VxWorks;功耗:请参阅用户指南了解详情;温度:标准工作:0 至 +60°C,存储:-20 至 +80°C;湿度:工作:10 至 90% RH湿度(无冷凝)/存储:5 至 95% RH(无冷凝);视频接口:3 个 TMDS (HDMI)/DisplayPort 1.2 接口,支持多流传输 (MST) | 分辨率高达 4k | VGA(可选);双通道 LVDS 发送器,支持平板 2x24 位接口 | VESA 和 openLDI 颜色映射 | 分辨率高达 1920x1200;通过 EDID/EPI 进行自动面板检测;尺寸:95 x 125 毫米(3.74 英寸 x 4.92 英寸)
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Highest Performance 3.5'' Single Board Computer based on 8th Generation Intel® Core™ processor series called "Whiskey Lake"Highest Performance 3.5'' Single Board Computer8th Generation Intel® Core™ Mobile Low Power U-Processors with up to 4 coresGen 9 Intel Graphics, up to 24 Execution UnitsMultiple Expansion card possibilitiesOption for 2nd internal video interface
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COM Express Type 6 Compact module based on 8th Generation Intel® Core™ processor family8th Generation Intel® Core™ SOC processorup to 4 coresConfiguration of display mode by software (LVDS/eDP)Low power consumption (TDP 15W, cTDP 10W)Up to 64 GByte dual channel DDR4 2400 MT/sOptional eMMC 5.1 on board mass storageTrusted Platform Module (TPM 2.0)
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Highest Performance Thin-Mini-ITX board based on 8th Generation Intel® Core™ Mobile Processors "Whiskey Lake"Highest Performance Thin Mini-ITX board8th Generation Intel® Core™ MobileLow Power U-Processors with up to 4 coresGen 9 Intel Graphics, up to 24EUOptions for 2nd internal displayWide Range Power Input 12-24 Voltcongatec embedded Board Controller Features
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COM Express® Mini Type 10 module based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s onboard Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing
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COM Express Type 6 Compact based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s onboard Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing (optional)
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Qseven module based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s onboard Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing Form Factor Qseven Form Factor | Qseven Spec. Rev. 2.1 compliant | 70 x 70 mm DRAM max. 16GB onboard LPDDR4x | up to 4.267 MT/s Ethernet Intel® GbE with TSN support and Out-Of-Band Management | real-time trigger I/O Interfaces 2x USB SuperSpeedPlus extentsion | up to 8x USB 2.0 (1x OTG) | 2x SATA III | 1x SDIO | 4x PCIe Gen3 | I²C Bus | SMBus | 1x SPI | UART | CAN | LPC | Mass Storage UFS 2.1 onboard flash up to 64 Gbyte Sound HD Audio Intel® LPE Audio via I2S Graphics Intel® HD Graphics LVDS Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 @60Hz | shared with eDP or MIPI-DSI x4 (option) DisplayPort Interface (DDI) DisplayPort 1.4 4096x2160px @60Hz or HDMI 2.0 4096+2160px @60Hz congatec Board controller Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics | fast mode and multi-master I²C bus | power loss control Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 MByte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Power Management ACPI 5 .0 compliant | Smart Battery Management Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux (Yocto Project) | Android | RTS Hypervisor Power Consumption Typ. Application: see manual for full details Temperature Range Commercial: Industrial: Operating Temperature: 0 to +60°C Operating Temperature: -40 to +85°C Storage Temperature: -20 to +80°C Storage Temperature: -40 to +85°C Humidity Operating Humidity: 10 to 90% r. H. non cond. Storage Humidity: 5 to 95% r. H. non cond. Size Qseven 70 x 70 mm (approx. 2.75” x 2.75”)
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Pico-ITX SBC based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing enable improved Realtime Capability Up to 4.267 MT/s Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing
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SMARC 2.1 module based on Intel® Atom® x6000E and Intel® Pentium® and Celeron® J Series processors High performance Intel® UHD Graphics (Gen11) Options for Industrial Temperature Range -40°C to 85°C Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability Up to 4.267 MT/s Memory Support with Inband ECC UFS 2.0 for higher bandwidth and data processing Product Video Form Factor SMARC Specification 2.1 | 82x50 mm DRAM max. 16GB onboard LPDDR4x with up to 4.267 MT/s Ethernet 2x Intel® GbE with TSN support and Out-Of-Band Management | 2x real-time trigger I/O Interfaces 2x USB 3.0 (1x OTG) | 6x USB 2.0 (1x OTG) | 1x SATA III | 1x SDIO | up to 4x PCIe Gen3 | 2x I²C Bus | 1x SPI I 1x eSPI | 4x UART | GPIO | 2x CAN | 1x I2S | onboard M.2 1216 WiFi/BT module (optional) Mass Storage UFS 2.1 onboard flash up to 64 Gbyte (optional up to 512 Gbyte) Sound Intel® LPE Audio via I2S Graphics Intel® HD Graphics LVDS Dual channel LVDS transmitter | support for flat panels with 2x24 bit data mapping up to a resolution of 1920x1200 @60Hz | shared with eDP or 1x MIPI-DSI x4 (option) DisplayPort Interface (DDI) DisplayPort 1.2 up to 4096x2160px and HDMI 1.4b up to 3840x2160px congatec Board controller Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics | fast mode and multi-master I²C bus | power loss control Embedded BIOS Feature AMI Aptio® UEFI firmware | 32 Mbyte serial SPI with congatec Embedded BIOS features OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update Power Management ACPI 5 .0 compliant | Smart Battery Management Operating Systems Microsoft® Windows 10 | Microsoft® Windows 10 IoT Enterprise | Microsoft® Windows IoT 10 Core | Linux | Android | Yocto | RTS Hypervisor Temperature Range Commercial: Industrial: Operating Temperature: 0 to +60°C Operating Temperature: -40 to +85°C Storage Temperature: -20 to +80°C Storage Temperature: -40 to +85°C Humidity Operating: 10 to 90% r. H. non cond. Storage: 50 to 95% r. H. non cond. Size 82 x 50 mm (approx. 3,23” x 1,97”)
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COM Express Compact Type 6 module based on Intel® Tiger Lake-UP3 high performing and low power Intel® Core™ processor series
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搭载第 11 代智能英特尔® 酷睿™ 处理器家族的 COM Express Type 6 基本模块 嵌入式/工业使用条件 提供扩展温度选项 PCI Express Gen 4 人工智能/深度学习指令集,包括 VNNI 选装板载 NVMe 固态硬盘 集成式英特尔锐炬® Xe(第 12 代)显卡,32 EU
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搭载第 11 代智能英特尔® 酷睿™ 处理器系列的 COM-HPC 高性能模块 嵌入式/工业使用条件 提供扩展温度选项 PCI Express Gen 4 | USB 4.0 人工智能/深度学习指令集,包括 VNNI DDR4-3200 MT/s,高达 128 GB 集成式英特尔锐炬® Xe(第 12 代)显卡,32 EU
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搭载第 11 代智能英特尔® 酷睿™ 处理器家族的 COM Express Type 6 基本模块 嵌入式/工业使用条件 提供扩展温度选项 PCI Express Gen 4 人工智能/深度学习指令集,包括 VNNI 选装板载 NVMe 固态硬盘 Xe(第 12 代)集成显卡,32 EU