Built with Purpose, Designed for Performance.

Break free from the limitations of legacy data center SSD form factors with the revolutionary new E1.L and E1.S Intel® SSDs based on EDSFF*. Featuring a common connector and pinout, the array of flexible, future-ready features enable a broad range of interoperable designs. Purpose-built to meet your toughest storage challenges and to always be the perfect fit.

Simply Revolutionary

Designed from the ground up, these revolutionary new EDSFF-based SSDs deliver flexible building blocks for scalable solutions, increased operational efficiency at scale and space-efficient capacity consolidating the storage footprint.

EDSFF was created to limit storage form factor proliferation by defining revolutionary industry standard form factors. This was driven by three guiding principles: enable scale, optimize total cost of ownership, and enable a dynamic range of solutions.

These principles were driven by key data center storage challenges, as surveyed from top IT decision makers: ability to scale capacity to support data and application growth, driving down the cost of storage—lowering operating and capital expenditures, while increasing storage agility, and to deliver required application performance without compromises. With a healthy and growing ecosystem, Intel supports EDSFF as the data center form factor standard of the future.

Now You Have Options

The E1.L and E1.S give you options for a variety of data center needs.

E1.L is a purpose-built form factor optimized for disaggregated systems. Providing high per server capacity, enabling up to 32 drives per rack unit for massive storage power. In addition to capacity, this form factor provides key features of thermal efficiency, full serviceability, scalability, and future ready performance.

E1.S provides the best of U.2 and M.2. E1.S in a scalable, flexible, power, and thermally efficient SSD building block. This form factor was designed for high volume hyperscale, and allows system flexibility, increased storage density, modular scaling, improved serviceability, and more efficient cooling optimized for 1U servers.

Optimized Capacity

EDSFF drives were designed to optimize capacity per drive. With 36 media sites on the E1.L this drive can scale to higher capacities without expensive and complex die stacking. The Intel SSD E1.L will scale up to 30.72TB of capacity in 2019.1 Using the 30.72TB E1.L form factor, you will be able to reach nearly 1PB of storage in 1U.2 This provides up to 10 times rack consolidation3 compared to 8TB U.2 15mm drives.

Space Isn’t All it Saves

E1.L provides programmable LEDs to quickly locate failed drives, offline drives, and un-populated slots. With a carrier-less design and an integrated latch, the E1.L removes the need for drive carriers. Advanced enclosure management with slot level power control enables single drive isolation. The E1.L is up to 2 times more thermally efficient than U.2 15mm drives,4while the E1.S is up to 3 times more thermally efficient than U.2 7mm drives.5 With a combination of built in serviceability and thermal efficiency, EDSFF drives allow you to increase operational efficiency at scale.



资料来源 - 英特尔。在需要保持相同温度的情况下,将 4TB U.2 15 毫米英特尔® 固态盘 DC P4500 与 4TB 外形基于 EDSFF 的英特尔® 固态盘 DC P4500 的通风情况进行对比。评测或模拟结果以内部分析或架构模拟或建模为基础,仅供参考。在一块金属板(代表服务器)中对采用不同外形的三款驱动器进行模拟,外形基于 EDSFF 的间距 12.5 毫米,海拔 1000 米,固态盘外壳温度限制为 70°C 或限制热量疏导性能(以先到者为准)。5°C 防护带。外形符合 EDSFF 规格的英特尔® 固态盘 P4510 预期将用作通风情况基准的结果。


资料来源 - 英特尔。在需要保持相同温度的情况下,将 8TB U.2 7 毫米英特尔® 固态盘 DC P4500 与 8TB EDSFF E1.S 外形的英特尔® 固态盘 DC P4510 的通风情况进行对比。评测或模拟结果以内部分析或架构模拟或建模为基础,仅供参考。模拟涉及比较每种外形的 1U 服务器实施。E1.S 的垂直间距为 11 毫米,U.2 7 毫米的水平间距为 18 毫米。两种外形周边均有一块金属板(代表服务器)。每种外形都受限于启动热量疏导的条件。


资料来源 - 英特尔。30.72TB 基于 EDSFF 的固态盘将于 2019 面世。这里提到的所有信息如有更改,恕不另行通知。请联系您的英特尔代表,以获取最新英特尔® 产品规格和发展蓝图。


资料来源 - 英特尔。使用 32 30.72TB 固态盘合计 983TB;每个使用 E1.L 外形的 1U 节点 32 个固态盘。基于后面将面世的 30.72TB 英特尔® 固态盘 D5-P4326。


资料来源 - 英特尔。将使用 32 个英特尔® 固态盘 D5-P4326 30.72TB(后面即将上市)在 1 个机架单元中达到最大容量 983TB 与使用英特尔® 固态盘 DC P4500 8TB 在 10 个机架单元中达到最大容量 960TB 进行了对比。

英特尔® 技术的功能和优势取决于系统配置,可能需要启用硬件、软件或激活服务。如需了解更多信息,请访问 intel.com,或者咨询生产厂家或零售商。