Built with Purpose, Designed for Performance.

Key Benefits

  • Consolidate and accelerate warm storage.

  • Enable 1PB of storage in just 1U.


Break free from the limitations of legacy data center SSD form factors with the revolutionary new E1.L and E1.S Intel® SSDs based on Enterprise and Data Center SSD Form Factor (EDSFF). Designed from the ground up, EDSFF-based SSDs deliver the building blocks for scalable solutions. Increased operational efficiency and massive space consolidation reducing the storage physical footprint, results in lower TCO. Featuring a common connector and pinout, the array of flexible, future-ready features enable a broad range of interoperable designs.

Designed to Meet Top Data Center Storage Challenges

Creation of EDSFF was guided by three principles: enable scale, optimize total cost of ownership, and enable dynamic range of solutions.

These principles were driven by key data center storage challenges, as surveyed from top IT decision makers, including: ability to scale capacity to support data and application growth, driving down the cost of storage—lowering operating and capital expenditures, while increasing storage agility, and deliver required application performance without compromises. With a healthy and growing ecosystem, Intel supports EDSFF as the data center form factor standard of the future.

Now You Have Options

The E1.L and E1.S give you options for a variety of data center needs.

E1.L is a form factor optimized for disaggregated systems. Providing high per server capacity, E1.L enables up to 32 drives per rack unit for massive storage power. In addition to capacity, this form factor provides key features of thermal efficiency, full serviceability, scalability, and future ready performance.

E1.S provides the best of U.2 and M.2.—a scalable, flexible, power, and thermally efficient SSD building block. This form factor was designed for high-volume hyperscale, and allows system flexibility, increased storage density, modular scaling, improved serviceability, and more efficient cooling optimized for 1U servers.

Optimized Capacity

EDSFF drives were designed to optimize capacity per drive. With 36 media sites on the E1.L this drive can scale to higher capacities without expensive and complex die stacking. The Intel SSD E1.L will scale up to 30.72TB of capacity, which means you can reach nearly 1PB of storage in 1U.1 This provides up to 10 times rack consolidation compared to 8TB U.2 15mm drives.

Space Isn’t All it Saves

E1.L provides programmable LEDs to quickly locate failed drives, offline drives, and un-populated slots. With a carrier-less design and an integrated latch, the E1.L removes the need for drive carriers. Advanced enclosure management with slot level power control enables single drive isolation. The E1.L is up to 2 times more thermally efficient than U.2 15mm drives,2 while the E1.S is up to 3 times more thermally efficient than U.2 7mm drives.3 With a combination of built in serviceability and thermal efficiency, EDSFF drives allow you to increase operational efficiency at scale.

Intel® Solid State Drives

Notices & Disclaimers

Performance varies by use, configuration and other factors. Learn more at www.Intel.com/PerformanceIndex.

Performance results are based on testing as of dates shown in configurations and may not reflect all publicly available updates. See backup for configuration details. No product or component can be absolutely secure.

Your costs and results may vary.

Intel does not control or audit third-party data. You should consult other sources to evaluate accuracy.

Intel technologies may require enabled hardware, software, or service activation.



资料来源 - 英特尔。使用 32 30.72TB 固态盘合计 983TB;每个使用 E1.L 外形的 1U 节点 32 个固态盘。基于后面将面世的 30.72TB 英特尔® 固态盘 D5-P4326。


资料来源 - 英特尔。在需要保持相同温度的情况下,将 4TB U.2 15 毫米英特尔® 固态盘 DC P4500 与 4TB 外形基于 EDSFF 的英特尔® 固态盘 DC P4500 的通风情况进行对比。评测或模拟结果以内部分析或架构模拟或建模为基础,仅供参考。在一块金属板(代表服务器)中对采用不同外形的三款驱动器进行模拟,外形基于 EDSFF 的间距 12.5 毫米,海拔 1000 米,固态盘外壳温度限制为 70°C 或限制热量疏导性能(以先到者为准)。5°C 防护带。外形符合 EDSFF 规格的英特尔® 固态盘 P4510 预期将用作通风情况基准的结果。


资料来源 - 英特尔。在需要保持相同温度的情况下,将 8TB U.2 7 毫米英特尔® 固态盘 DC P4500 与 8TB EDSFF E1.S 外形的英特尔® 固态盘 DC P4510 的通风情况进行对比。评测或模拟结果以内部分析或架构模拟或建模为基础,仅供参考。模拟涉及比较每种外形的 1U 服务器实施。E1.S 的垂直间距为 11 毫米,U.2 7 毫米的水平间距为 18 毫米。两种外形周边均有一块金属板(代表服务器)。每种外形都受限于启动热量疏导的条件。