This document provides guidelines for the design of thermal and mechanical solutions for the Intel® Xeon® processor E5-2400 v3 product family. Unless specifically required for clarity, this document will use "processor" in place of the specific product names. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention ...hardware.
• The LGA1356 socket, the Independent Loading Mechanism (ILM), and back plate.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.