Customer Advisories,

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Process Change Notifications
Title Release Date File Size
PCN 1408 Transfer of Wafer Bump Operations Feb 2015 116 KB
PCN 1407 Additional Assembly Site for FLEX 6K and Stratix Products Nov 2014 75 KB
PCN 1312 Rev 1.1.0 Additional Foundry Source for MAX II Z Products Nov 2013 194 KB
PCN 1205 Rev 1.3.0 Additional Assembly Source (ASE) and Transition to Center Pin Gate Mold for FBGA Packages Jan 2013 539 KB
PCN 1201 Additional Assembly Source (ASE) for the MAX V Device Family Apr 2012 141 KB
PCN 1105 Rev 1.3.0 Introducing "Green" Materials and Bill of Material Change for the Cyclone II and MAX II Devices Mar 2012 528 KB
PCN 1106 Rev 1.2.0 Additional Bill of Materials and Suppliers for Altera's Flip Chip and Wirebond BGA Packages Oct 2011 248 KB
PCN 1003 Rev 1.2.0 Alternative Assembly Site for the EPCS Serial Configuration Device Family Mar 2011 231 KB
PCN 1102 Additional Wafer Fabrication Site for Stratix IV, Arria II, and HardCopy Devices Jan 2011 210 KB
PCN 1002 Additional Assembly Source and Power Quad Flat Pack (RQFP) 208 and 240 Package Conversion Jun 2010 85 KB
PCN 0714 Rev 1.3.0 Assembly Plant Change for PQFP and TQFP Packages Jun 2010 60 KB
PCN 0904 Rev 1.2.0 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Jun 2010 113 KB
PCN 0902 Rev 1.1.0 Additional Assembly Source and Bill of Material Change for Altera Flip Chip Products Feb 2010 620 KB
PCN 0805 Rev 1.6.0 Wafer Fabrication Site Change for Serial Configuration Devices Dec 2009 101 KB
PCN 0903 Rev 1.0.1 Alternative Assembly Site for the EPC Configuration Family Nov 2009 91 KB
PCN 0901 Rev 1.1.0 Substrate Change for Selected FBGA Packages Mar 2009 205 KB
PCN 0513 Rev 1.2.1 Additional TSMC Wafer Fabrication Site Nov 2008 40 KB
PCN 0813 Polyimide Wafer Coat Removal for Selected Altera Devices Oct 2008 86 KB
PCN 0801 Rev 1.1.0 Alternative Manufacturing Site for EPCS Family Sep 2008 28 KB
PCN 0808 Wire-Bond Diameter Reduction for Selected TQFP Packages Sep 2008 78 KB
PCN 0803 Package-Lid Stiffener Change for the Stratix Flip-Chip Family Mar 2008 69 KB
PCN 0802 Additional TSMC Wafer Fabrication Site for Cyclone III FPGAs Feb 2008 24 KB
PCN 0715 Rev 1.1.1 Alternate Kyocera Substrate for Flip-Chip Packages Jan 2008 81 KB
PCN 0716 Additional TSMC Wafer Fabrication Site for Stratix GX FPGAs Nov 2007 24 KB
PCN 0708 Rev 1.1.0 Encapsulant Material Change for BGA Pb-Free Packages Oct 2007 30 KB
PCN 0712 Mold Compound Changes for BGA, UBGA, MBGA and FBGA Packages Oct 2007 87 KB
PCN 0702 Rev 1.2.0 Mold Compound Change for PQFP, PDIP, and RQFP Packages Sep 2007 97 KB
PCN 0710 Discontinuance of QFP Carriers for MAX 7000 Devices Jul 2007 28 KB
PCN 0707 Sealing Glass Change for Ceramic Dual In-Line Package Assembled in the Philippines Mar 2007 84 KB
PCN 0701 EPCS16SI16N Process Change Jan 2007 73 KB
PCN 0412 Rev01 FineLine BGA Substrate Second Source (Kinsus) Jul 2006 18 KB
PCN 0602 Mold Compound Change for Cyclone II PQFP & TQFP Packages Apr 2006 33 KB
PCN 0603 Cyclone II Family M4K Memory Block Modification Apr 2006 125 KB
PCN 0517 Introducing Kinsus BT Substrate for BGA 600 and 652 Packages Mar 2006 74 KB
PCN 0515 Mold Compound Change for FPGA Packages Jan 2006 41 KB
PCN 0516 Mold Compound Change For PBGA Packages Dec 2005 39 KB
PCN 0514 Manufacturing Changes on EPCS Family Oct 2005 35 KB
PCN 0512 Implementing Standard Sumitomo-G6000 Series Mold Compound for PLCC Packages Aug 2005 32 KB
PCN 0506 Addition of Intel Flash Memory as Source for EPC4, EPC8 & EPC16 Enhanced Configuration Devices Aug 2005 61 KB
PCN 0504 Standardized EME-G700 Series Mold Compound for QFP Packages Jul 2005 32 KB
PCN 0415 Additional Mold Compound for FBGA Packages from ASE Malaysia Nov 2004 12 KB
PCN 0414 Standardized EME-G700 Mold Compound for TQFP Packages Nov 2004 16 KB
PCN 0413 Additional Wafer Fabrication Site (Fab 14 ) Jul 2004 20 KB
PCN 0410 Additional Assembly, Test, and FGI Location Jun 2004 20 KB
PCN 0411 Additional Test and Finished Goods Inventory Location Jun 2004 20 KB
PCN 0407 UFBGA 88 Package Substrate Change May 2004 11 KB
PCN 0404 Additional Mold Compound for TQFP 144 Package Mar 2004 11 KB
PCN 0310 Mold Compound Change for 100 Lead QFP Package Aug 2003 7 KB
PCN 0304 300 MM Wafer Schedule May 2003 14 KB
PCN 0216 New Wafer Fabrication Source Nov 2002 56 KB
PCN 0214 Copper Lid for Selected Altera BGA and FineLine BGA Packages Oct 2002 13 KB
PCN 0119 ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100 Nov 2001 14 KB
PCN 0116 Amkor Korea will be added as a second source for FineLine BGA packages currently assembled in ASAT, Hong Kong Oct 2001 11 KB
PCN 0114 Configuration Device Flash Memory Supply Source Addition Aug 2001 9 KB
PCN 0113 FineLine BGA and QFP Package Assembly Site Addition Aug 2001 10 KB
PCN 0109 ACEX 1K Device Process Improvement Jan 2001 10 KB
PCN 0010 MAX 3000A Device Process Transition Nov 2000 10 KB
PCN 0008 MAX 7000AE Device Process Transition Sep 2000 12 KB
PCN 0005 EP20K400 Device Process Migration Mar 2000 12 KB
PCN 9918 EPM7064 & EPM7064S Additional Source of Supply Dec 1999 9 KB
PCN 9915 EPF10K50V Device Process Transition Aug 1999 13 KB
PCN 9911 EPF10K50E And EPF10K200E Device Process Migration Jun 1999 14 KB
PCN 9903 EPF6010A, EPF6016A, and EPF6024A devices transition to a 0.3-micron process at WaferTech Jan 1999 16 KB
PCN 9901 FLEX 10K and FLEX 6016 devices transition to a 0.42-micron process at WaferTech Jan 1999 18 KB
PCN 9810 EPF10K50V, EPF10K10A, EPF10K30A, and EPF10K100A devices move to a 0.3-micron process Aug 1998 16 KB
PCN 9805 Additional source of supply for FLEX 10K and FLEX 6000 products May 1998 20 KB
PCN 9802 EPC1064 and EPC1213 Devices Feb 1998 22 KB
PCN 9703 MAX 7000 & MAX 9000 Feb 1997 85 KB
PCN 9702 Transition Schedule Update EPM7256E Feb 1997 84 KB
PCN 9616 Assembly & Test Site Addition Sep 1996 86 KB
PCN 9619 EPM7192E & EPM7256E Devices Sep 1996 90 KB
PCN 9612 Test & Shipment Site Addition Jun 1996 81 KB
PCN 9604 MAX 9000 devices transitioned to a 0.65 micron process Mar 1996 85 KB
PCN 9510 Transition of Classic devices to a 0.65-micron process Oct 1995 89 KB
PCN 9509 Preliminary reliability data for the 8" 0.6-micron FLEX 8000A devices Sep 1995 85 KB
PCN 9514 Additional source of supply for MAX 7000 devices Jun 1995 82 KB
PCN 9501 Reliability data and transition dates for the EPM7032 assembled in ASE Penang Jan 1995 151 KB
PCN 9407 MAX 5000 to transition from a 0.8-micron EPROM process to a 0.65-micron EPROM process, 1994 Jul 1994 97 KB
Product Discontinuance Notices
Title Release Date File Size
PDN 1403 Altera will be discontinuing select Altera IP MegaCore function ordering codes Mar 2014 45 KB
PDN 1310 Altera will be discontinuing the Cyclone III Embedded Systems Development Kit ordering code Sep 2013 43 KB
PDN 1306 Altera will be discontinuing select Altera IP MegaCore ordering codes Jun 2013 106 KB
PDN 1304 Altera will be discontinuing select Altera IP MegaCore ordering codes Apr 2013 113 KB
PDN 1303 Altera will be discontinuing the Stratix IV E FPGA Development Kit ordering code Mar 2013 108 KB
PDN 1208 Altera will be discontinuing select Nios II C-to-Hardware (C2H) Acceleration Compiler ordering codes Dec 2012 97 KB
PDN 1207 Altera will be discontinuing select IP Reference Design ordering codes Nov 2012 95 KB
PDN 0912 Altera will be discontinuing select APEX 20K ordering codes Oct 2009 20 KB
PDN 0911 Altera will be discontinuing select APEX 20KE ordering codes Sep 2009 20 KB
PDN 0906 Altera will be discontinuing the IP MegaCore® ordering codes listed in Table 1 of this document. Aug 2009 31 KB
PDN 0903 Rev 1.0.1 Altera will be discontinuing select MAX 7000B, MAX 7000 and MAX 7000S device ordering codes Jun 2009 26 KB
PDN 0704 Rev 1.1.0 Altera will be discontinuing the EPCS16SI16N ordering code Jan 2008 17 KB
PDN 0711 Altera will be discontinuing select APEX 20KC, APEX II, FLEX 8000, MAX 7000B, MAX 9000, and Excalibur ordering codes May 2007 19 KB
PDN 0706 Rev 2 Altera will be discontinuing select APEX 20K, APEX II, FLEX 8000, MAX 9000, and Excalibur ordering codes Feb 2007 22 KB
PDN 0705 Altera will be discontinuing the EPM7096 products Feb 2007 16 KB
PDN 0703 Altera will be discontinuing the PL-APU ordering code Feb 2007 12 KB
PDN 0610: Altera will be discontinuing select programming adapter ordering codes Dec 2006 18 KB
PDN 0609: Altera will be discontinuing the PL-MASTERBLASTER ordering code Dec 2006 12 KB
PDN 0605 Altera will be discontinuing the remaining Classic device ordering codes Jul 2006 20 KB
PDN 0604 Altera will be discontinuing select Classic device ordering codes Jun 2006 62 KB
PDN 0518 Altera will be discontinuing select APEX II, APEX 20K, APEX 20KC, APEX 20KE,Classic, FLEX 8000, MAX 3000A, MAX 7000, MAX 7000B, and MAX 7000S ordering codes Dec 2005 29 KB
PDN0510 Altera will be discontinuing select APEX 20K, APEX 20KC, APEX 20KE, APEX II, Classic, Configuration Device, FLEX 10KA, FLEX 10KE, FLEX 6000, FLEX 8000, MAX 7000, MAX 7000A, MAX 7000B, MAX 7000S, and MAX 9000 ordering codes Jul 2005 53 KB
PDN 0509 Altera will be discontinuing select Classic and MAX 9000 ordering codes Jun 2005 20 KB
PDN 0508 Altera will be discontinuing EPM7256A ordering codes Apr 2005 19 KB
PDN 0507 Altera will be discontinuing EPM7128A ordering codes Apr 2005 19 KB
PDN 0409 Altera has discontinued the ARM Developer Suite (ADS) Lite software tool for Altera Excalibur devices May 2004 11 KB
PDN 0408 Altera will be discontinuing the PCI APEX Development Kits, and PCI32 Nios Target Add-On Kit May 2004 12 KB
PDN0405 Altera has discontinued the Nios APEX Development Kits, Nios Ethernet Kit, and Nios Linux Development Kit. Apr 2004 12 KB
PDN0402 Altera has discontinued the printed version of the MAX+PLUS II manual. Jan 2004 13 KB
PDN0401 Altera will be discontinuing several APEX 20K ordering codes Jan 2004 13 KB
PDN 0316 Altera will be discontinuing certain APEX 20KE device ordering codes Dec 2003 12 KB
PDN 0315 Altera will be discontinuing certain configuration device ordering codes Dec 2003 11 KB
PDN 0314 Altera will be discontinuing certain configuration, FLEX 10KA, FLEX 10KE, FLEX 6000, and FLEX 8000 device ordering codes Dec 2003 14 KB
PDN 0313 Quartus II Software Support for Mentor Graphics Blast Software Oct 2003 14 KB
PDN 0312 Altera will be discontinuing the IP MegaCore products listed in Table 1 Sep 2003 18 KB
PDN 0311 Altera will be discontinuing the APEX DSP Development Kits Starter Version and Professional Edition products Aug 2003 80 KB
PDN 0307 Altera will be discontinuing the ByteBlasterMV parallel port download cable Jun 2003 7 KB
PDN 0303 Altera will be discontinuing some Excalibur board products Feb 2003 86 KB
PDN 0302 Altera will be discontinuing ordering codes: PCI-BOARD/A4E & PCI-BOARD/A4E/UNIV Jan 2003 76 KB
PDN 0221 Altera will be discontinuing ordering codes PCI-BOARD2/S & PCI-BOARD2/S/UNIV Dec 2002 79 KB
PDN 0220 FLEX 10KA Product Ordering Codes to Become Obsolete Dec 2002 85 KB
PDN 0218 Quartus II & MAX+PLUS II Software Operating System Support, October 30, 2002 Oct 2002 65 KB
PDN 0204 Altera will be discontinuing certain APEX 20K, APEX 20KE, FLEX 10KE, and ACEX 1K device ordering codes Apr 2002 15 KB
PDN 0203 Altera will be discontinuing certain MAX 7000S, MAX 7000A, and MAX 7000B device ordering codes Apr 2002 14 KB
PDN 0209 Altera will be discontinuing certain QFP programming and development sockets Mar 2002 11 KB
PDN 0124 Altera is discontinuing all extraction tools Dec 2001 8 KB
PDN 0122 Altera will be discontinuing the PL-ASAP2 programming hardware and the PL-MPU and PLP6 components that comprise the PL-ASAP2 product Nov 2001 57 KB
PDN 0118 Altera began launching new, flexible ways to purchase MegaCore IP functions Nov 2001 101 KB
PDN 0117 Discontinued MAX 7000, MAX 9000, FLEX, and APEX 20K ordering codes, October 25, 2001 Oct 2001 12 KB
PDN 0110 PCI-Board2, SOPC-Board/A6E, SOPC-Board/A10E to Become Obsolete Apr 2001 9 KB
PDN 0107 Selected FLEX 8000, FLEX 10K, FLEX Devices 10KA, FLEX 10KE, and APEX 20K Jan 2001 11 KB
PDN 0106 Selected MAX 9000 Devices Jan 2001 11 KB
PDN 0103 Selected MAX 7000 Devices Jan 2001 8 KB
PDN 0102 Selected Classic Devices Jan 2001 8 KB
PDN 0007 EPF10K100B To Become Obsolete Jun 2000 10 KB
PDN 9917 Selected Adapters to Become Obsolete Dec 1999 9 KB
PDN 9907 EPM7032V to become obsolete Jun 1999 13 KB
PDN 9817 Fourteen maintenance products are being discontinued Oct 1998 14 KB
PDN 9816 Six development system products are being discontinued Aug 1998 10 KB
PDN 9713 EPM7256SRC208-12 Update Sep 1997 4 KB
PDN 9710 Selected programming adapters for the EPM5016 are being obsoleted Aug 1997 4 KB
PDN 9709 Discontinued ordering codes and replacement products for Altera development tools Aug 1997 48 KB
PDN 9625 FLASHlogic EPX880 & EPX8160 to Become Obsolete Dec 1996 50 KB
PDN 9624 MAX 5000 Update Dec 1996 129 KB
PDN 9620 FLASHlogic Download Cable (PL-FLDLC) Sep 1996 85 KB
PDN 9618 Selected MAX 9000 Ordering Codes Sep 1996 85 KB
PDN 9610 In 1996, Altera will be consolidating the MAX 5000 device family which will result in selected device ordering codes being discontinued as shown in the Product Discontinuance Notice Apr 1996 9 KB
PDN 9603 Selected FLEX 8000 devices to be discontinued Feb 1996 91 KB
PDN 9601 EPX780 to be discontinued Jan 1996 96 KB
PDN 9517 FLEX 8000 & EPC1213 military device obsolescence schedule Dec 1995 146 KB
PDN 9516 Selected MAX devices to be discontinued Dec 1995 30 KB
PDN 9513 Military products to be discontinued Jun 1995 48 KB
PDN 9512 Selected FLEX 8000 devices to be discontinued Jun 1995 85 KB
PDN 9511 This notice is to announce Altera's intent to discontinue the EP310I device in 1996. The schedule for phase-out is noted in the Product Discontinuance Notice Jun 1995 8 KB
PDN 9508 Selected Classic devices to be discontinued Jun 1995 132 KB
PDN 9401 Phase-out of selected military devices previously acquired from Intel Jun 1995 130 KB
Customer Advisory
Title Release Date File Size
ADV 1405 Altera Cyclone V FPGA Product Family Ordering Information Update Aug 2014 92 KB
ADV 1314 Acquisition of Enpirion Inc., by Altera Corporation Nov 2013 72 KB
ADV 1313 Altera Cyclone V GX FPGA Development Kit Update Oct 2013 60 KB
ADV 1311 PowerSoC Product Shipment Box and Label Format Changes Sep 2013 379 KB
ADV 1309 Additional Dimples On Plastic BGA Package Top Surface Sep 2013 130 KB
ADV 1307 Altera FPGA Product Family Ordering Information Update Jun 2013 230 KB
ADV 1305 Altera Shipment Box and Label Changes May 2013 182 KB
ADV 1301 Additional Dimples on PBGA Package Top Surface Mar 2013 160 KB
ADV 1104 Rev 1.2.0 Second Foundry Source Qualification for the MAX II/G and MAX II Z Devices May 2012 255 KB
ADV 1204 Additional Altera Company Label Included On the Moisture Barrier Bag for Altera Configuration Devices Apr 2012 256 KB
ADV 1202 Full Laser Mark Introduction for Products Using Lidded/Heat Spreader Packages Feb 2012 125 KB
ADV 1101 Enhancements to Altera Moisture Barrier Bag and Unit Box Labels Mar 2011 477 KB
ADV 1103 Topside Mark Change for Altera Arria II GX Devices Jan 2011 181 KB
ADV 1007 Rev 1.0.1 Additional Bump Line for Altera's Flipchip Devices Jan 2011 156 KB
ADV 1005 Additional Assembly Site for the Arria II GX FBGA Package Oct 2010 160 KB
ADV 0908 Rev 1.0.1 Product Shelf Life Extension to 36 Months Dec 2009 275 KB
ADV 0907 Additional Assembly Plant for MBGA Packages Aug 2009 133 KB
ADV 0901 Implementing New Shipping Carton Label Feb 2009 517 KB
ADV 0813 Product Discontinuance Notice (PDN) Policy Nov 2008 18 KB
ADV 0812 Additional Package Option for Selected Stratix III FPGA Devices May 2008 66 KB
ADV 0804 TSMC Wafer Fabrication Sites for the Stratix III FPGA Family Mar 2008 25 KB
ADV 0217 Rev 1.1.0 Full Laser Marking Introduction Feb 2008 17 KB
ADV 0607 UFBGA 484 Package Coplanarity Enhancement Nov 2006 61 KB
ADV 0601 Rev01 Addition of Assembly Plant for FBGA Packages Mar 2006 22 KB
ADV 0505 Adding Daewon shipping tray for BGA and QFP Package Devices May 2005 21 KB
ADV 0501 Implementing Pb-Free Marking Codes and Indication on Labels Mar 2005 1 MB
ADV 0503 Serial Configuration Device Plating Standardization Mar 2005 16 KB
ADV 0502 Serial Configuration Device Plating Standardization Mar 2005 17 KB
ADV 0406 TQFP 32 Package Top Mold and Ejector Size Change May 2004 14 KB
ADV 0306 Introduction of Dual Marking on MAX 3000A Devices May 2003 56 KB
ADV 0305 Additional Source for Altera's PowerQuad Flat Pack Package for the FLEX 10K and APEX Device Families Mar 2003 82 KB
ADV 0202 Schedule for the MAX 7000AE and MAX 3000A transition to a 0.30-µm process at TSMC, Taiwan Feb 2002 13 KB
ADV 0201 Marking the assembly lot number and a one-line internal traceability code on all non-BGA packages Feb 2002 10 KB
ADV 0115 EP20K200E and EP20K300E 652-pin BGA packages will be reinforced with a stiffener Dec 2001 8 KB
ADV 0012 BGA Package Top Mark Enhancement Dec 2000 9 KB
ADV 0009 FLEX 10K Transition Schedule Update Sep 2000 10 KB
ADV 0003 Alternate QFP Shipping Trays Jan 2000 10 KB
ADV 0001 Additional Assembly Location Jan 2000 10 KB
ADV 9916 Top Mark Enhancement Nov 1999 11 KB
ADV 9914 Additional Assembly Source Aug 1999 10 KB
ADV 9912 FineLine BGA Packages Jun 1999 21 KB
ADV 9910 Test and Shipment Site Addition Apr 1999 12 KB
ADV 9909 EPF6016 and FLEX 10K Transition Schedule Update Apr 1999 18 KB
ADV 9906 Change in Tray Temperature Tolerance Mar 1999 11 KB
ADV 9904 Additional Source of Supply for Configuration Devices Jan 1999 20 KB
ADV 9814 PLCC Moisture Sensitivity Level Reclassification Aug 1998 12 KB
ADV 9812 EPC1064 and EPC1213 Transition Schedule Update Jul 1998 14 KB
ADV 9809 PL-MANUAL, PL-MANUALWS, PL-MNLVHDL, and PL-MNLVERILOG manuals to be consolidated into PL-MANUAL Jun 1998 10 KB
ADV 9803 EPM7032, EPM7160E, EPM9320, and EPM9560 Transition Schedule Update Mar 1998 12 KB
ADV 9801 FLEX 10K Moisture Rating Enhancement Jan 1998 13 KB
ADV 9712 FLEX 10K Additional Source of Supply Sep 1997 29 KB
ADV 9708 MAX 7000 & MAX 9000 0.5-micron Transition Schedule Update Jun 1997 33 KB
ADV 9707 Top Mark Traceability Enhancements May 1997 46 KB
ADV 9705 RQFP & TQFP Moisture Reclassification May 1997 59 KB
ADV 9701 Manufacturing Site Change Feb 1997 83 KB
ADV 9606 MAX 5000 Transition Schedule Update Feb 1997 39 KB
ADV 9623 FLEX 10K Ordering Code Change Dec 1996 117 KB
ADV 9622 FLEX 8000 Ordering Code Change Dec 1996 113 KB
ADV 9621 Classic Family Transition Schedule Update Nov 1996 91 KB
ADV 9617 Date Code Format Aug 1996 86 KB
ADV 9615 FLEX 10K Ordering Code Change Jun 1996 143 KB
ADV 9614 Glass Seal PGA Jun 1996 81 KB
ADV 9611 New Assembly Site Jun 1996 81 KB
ADV 9608 EP9XX and EP18XX Ordering Code Change Mar 1996 147 KB
ADV 9609 MAX 5000 Ordering Code Change Mar 1996 148 KB
ADV 9607 Process transition update for Classic devices Jan 1996 83 KB
ADV 9518 Ordering code changes for EP6xx devices Dec 1995 87 KB
ADV 9505 FLEX 8000 devices in 208-, 240-, and 304-pin RQFP packages to be shipped in dry packs Jun 1995 52 KB
ADV 9515 Errata for Process Change Notification 9407 Jun 1995 52 KB
ADV 9507 Ordering code changes for Classic devices Jun 1995 100 KB
ADV 9506 Ordering code change for the EPM7192, EPM7160, and EPM7128 devices Jun 1995 93 KB
ADV 9502 Transition from a dual mark to a single mark for all products acquired from Intel Apr 1995 115 KB
ADV 9401 New marking procedure for 240- and 304-pin power quad flat pack (RQFP) packages Dec 1994 66 KB