技术规格
基本要素
状态
Launched
产品集
英特尔® 服务器系统 S9200WK 家族
主板板型
8.33” x 21.5”
支持的操作系统
Red Hat Enterprise Linux 7.6*, SUSE Linux Enterprise Server 12 SP4*, CentOS 7.4*
机箱板型
2U Rack front IO
提供集成系统
是
包括的项目
(1) Server board
(1) 1U compute module tray
(2) Intel® Xeon® Platinum 9221 Processor
(2) 1U riser assembly
(2) Processor heatsinks
(1) 1U compute module tray
(2) Intel® Xeon® Platinum 9221 Processor
(2) 1U riser assembly
(2) Processor heatsinks
主板芯片组
目标市场
High Performance Computing
补充信息
封装规格
最大 CPU 配置
2
用户评论
Key Features
Maximum 2nd Generation Intel® Xeon® Platinum 9200 Processors Performance
- Maximum 2nd Generation Intel® Xeon® Platinum 9200 Processors performance
- Leadership CPU performance per socket with Intel's highest core count, 2nd Generation Intel® Xeon® Platinum 9200 processors
- Double the memory bandwidth for memory-intensive workloads with 12 memory channels per CPU, 24 memory channels per compute module
- New Intel® Deep Learning Boost (Intel® DL Boost) Instructions for data analytics greatly accelerates inference performance
- Multi-Chip packaging optimized for density and performance
- Density Optimized 2U Rack Server with Air-Cooled option
- Up to four compute modules per 2U chassis which can support multiple compute module types in a single chassis
- 2 CPU compute module design with advanced cooling technology for high flow rate air cooling
- Up to 250W processor TDP for high performance workloads in a 2U air cooled chassis
- 2 x16 PCIe* slots in 1U compute modules for network expansion options
- Support for 2x M.2 SATA/NVMe* storage devices per 1U compute module
- Hot-swappable compute modules, fans, and power supplies
密度优化型系统解决方案使高性能计算 (HPC) 和 AI 实现领先性能
先进的液体冷却
进行 CPU 计算模块设计,使用先进的冷却技术为 CUP、VR、DIMM 和高热捕捉率内存 VR 进行高流速空气冷却或液体冷却。机箱级别的本机液体冷却支持提供了一个完整的液体冷却数据中心模块解决方案。
产品和性能信息
此特性并非在所有计算系统上均可用。请咨询系统供应商,以了解您的系统是否有此特性,或参考系统规格(主板、处理器、芯片、电源、硬盘、图形控制器、内存、BIOS、驱动程序、虚拟机监视器 - VMM、平台软件和/或操作系统)以了解特性兼容性。此特性的功能、性能和其它优势可能根据系统配置的不同而不同。