技术规格
基本要素
额外的延长保修详细信息
Dual Processor System Extended Warranty
机箱板型
2U, Spread Core Rack
机箱尺寸
16.93" x 27.95" x 3.44"
主板板型
Custom 16.7" x 17"
兼容产品系列
2nd Generation Intel® Xeon® Scalable Processors
插座
Socket P
包括散热器
是
系统主板
主板芯片组
目标市场
Mainstream
机架友好主板
是
电源
1300 W
电源类型
AC
包含的电源数
1
支持的冗余电源
Supported, requires additional power supply
背板
Included
包括的项目
(1) 2U Chassis with Quick Reference Label affixed to top cover
(1) Intel® Server Board S2600WF0R (no onboard LAN)
(2) PCIe* riser card brackets.
(2) 3-slot PCIe* riser cards A2UL8RISER2
(1) 2-slot low profile PCIe* riser card A2UX8X4RISER
(8) 2.5” hot-swap drive bays
(1) SAS/NVMe combo backplane F2U8X25S3PHS
(8) 2.5” hot-swap drive tool less carriers FXX25HSCAR3
(1) Standard control panel assembly (iPC FXXFPANEL2)
300 mm front panel cable
(1) Front I/O panel assembly (1) x VGA and 2 x USB)
(1) Backplane I2C cable
(2) Mini SAS HD cable
(1) Backplane power cable
(1) SATA optical drive power (1) SATA optical drive bay mounting kit
(1) Standard 2U Air duct
(6) Hot swap system fans FR2UFAN60HSW
(8) DIMM slot blanks
(1) 1300W AC power supply module AXX1300TCRPS
(2) CPU heat sinks FXXCA78X108HS
(2) CPU heat sink “NO CPU” Mylar* spacer insert
(1) Intel® Server Board S2600WF0R (no onboard LAN)
(2) PCIe* riser card brackets.
(2) 3-slot PCIe* riser cards A2UL8RISER2
(1) 2-slot low profile PCIe* riser card A2UX8X4RISER
(8) 2.5” hot-swap drive bays
(1) SAS/NVMe combo backplane F2U8X25S3PHS
(8) 2.5” hot-swap drive tool less carriers FXX25HSCAR3
(1) Standard control panel assembly (iPC FXXFPANEL2)
300 mm front panel cable
(1) Front I/O panel assembly (1) x VGA and 2 x USB)
(1) Backplane I2C cable
(2) Mini SAS HD cable
(1) Backplane power cable
(1) SATA optical drive power (1) SATA optical drive bay mounting kit
(1) Standard 2U Air duct
(6) Hot swap system fans FR2UFAN60HSW
(8) DIMM slot blanks
(1) 1300W AC power supply module AXX1300TCRPS
(2) CPU heat sinks FXXCA78X108HS
(2) CPU heat sink “NO CPU” Mylar* spacer insert
补充信息
说明
Integrated 2U system featuring an Intel® Server Board S2600WF0R, supporting two 2nd Generation Intel® Xeon® Scalable processors, (8) 2.5 inch hot-swap drives, 24 DIMMs, (1)1100W redundant-capable power supply.
内存和存储
前驱动器外形
Hot-swap 2.5"
支持的后驱动器数量
2
后驱动器外形
2.5" SATA (optional)
支持的内驱动器数量
2
内驱动器外形
M.2 SSD
扩展选项
转接卡插槽 2：通道总数
24
转接卡插槽 3：通道总数
12
I/O 规格
光驱/光盘驱动器支持
是
封装规格
最大 CPU 配置
2
