技术规格
基本要素
可购买延长保修期（选择国家或地区）
是
额外的延长保修详细信息
Dual Processor System Extended Warranty
机箱板型
1U, Spread Core Rack
机箱尺寸
16.93" x 27.95" x 1.72"
主板板型
Custom 16.7" x 17"
兼容产品系列
2nd Generation Intel® Xeon® Scalable Processors
散热器
(2) 1U Standard Heat Sink FXXCA78X108HS
包括散热器
是
系统主板
主板芯片组
目标市场
Mainstream
机架友好主板
是
电源
1100 W
电源类型
AC
包含的电源数
1
支持的冗余电源
Supported, requires additional power supply
背板
Included
包括的项目
(1) 1U chassis with Quick Reference Label affixed to top cover
(1) Intel® Server Board S2600WF0R (no onboard LAN)
(2) Riser card assembly with 1 slot PCIe x16 riser card iPC F1UL16RISER3
(4) 3.5” hot-swap drive bays with drive carriers and drive blanks. Includes:
(1) 12 Gb SAS backplane FR1304S3HSBP
(4) 3.5” hot swap drive tool less carriers FXX35HSCAR2
(1) Pre-installed standard control panel assembly
(board only FXXFPANEL2)
260 mm front panel cable
(1) Pre-installed front I/O panel assembly (1 x VGA and 2 x USB)
(1) 150 mm backplane I2C cable
(1) 850 mm mini SAS HD cable AXXCBL850HDHRT
(1) 350 mm backplane power cable
(1) Air duct
(6) Dual rotor system fans FR1UFAN10PW
(1) 1100W power supply module - iPC AXX1100PCRPS
(2) CPU heat sinks, 39 fin passive
(2) CPU heat sink “No CPU” label inserts
(2) Standard CPU Carriers
(8) DIMM slot blanks
(1) Chassis Stif
(1) Intel® Server Board S2600WF0R (no onboard LAN)
(2) Riser card assembly with 1 slot PCIe x16 riser card iPC F1UL16RISER3
(4) 3.5” hot-swap drive bays with drive carriers and drive blanks. Includes:
(1) 12 Gb SAS backplane FR1304S3HSBP
(4) 3.5” hot swap drive tool less carriers FXX35HSCAR2
(1) Pre-installed standard control panel assembly
(board only FXXFPANEL2)
260 mm front panel cable
(1) Pre-installed front I/O panel assembly (1 x VGA and 2 x USB)
(1) 150 mm backplane I2C cable
(1) 850 mm mini SAS HD cable AXXCBL850HDHRT
(1) 350 mm backplane power cable
(1) Air duct
(6) Dual rotor system fans FR1UFAN10PW
(1) 1100W power supply module - iPC AXX1100PCRPS
(2) CPU heat sinks, 39 fin passive
(2) CPU heat sink “No CPU” label inserts
(2) Standard CPU Carriers
(8) DIMM slot blanks
(1) Chassis Stif
补充信息
说明
Integrated 1U system featuring an Intel® Server Board S2600WF0R, supporting two 2nd Generation Intel® Xeon® Scalable processors, (4) 3.5 inch hot-swap drives, 24 DIMMs, (1)1100W redundant-capable power supply, Intel® OCP Module.
内存和存储
前驱动器外形
Hot-swap 3.5" HDD or 2.5" SSD
支持的内驱动器数量
2
内驱动器外形
M.2 SSD
扩展选项
I/O 规格
封装规格
最大 CPU 配置
2
