Powering the Next Generation of Advanced Cellular Devices

Discover the Benefits

  • Designed for Worldwide Mobility

  • Leading-Edge Performance and Data Quality

  • Optimized Power Consumption

  • Enhanced Features


LTE Advanced Pro modem aggregating up to 7 download link bands for the next generation of advanced cellular devices.

Single-SKU Global Coverage. Gigabit+ Speeds. 14nm for Slim, Powerful Designs.

The Intel® XMM™ 7660 modem is Intel’s sixth generation LTE modem and it demonstrates our commitment to deliver leading-edge cellular technology that exceeds gigabit downlink speeds, provides low latency, as well as RF innovations which allow customers to build world-wide radios in a single SKU. The modem, which is designed via 14nm manufacturing process, delivers high-speed LTE-advanced connectivity for quality voice calls and data-intensive applications, including video streaming, multi-player gaming, virtual reality applications and more.

The Intel® XMM™ 7660 modem meets the Release 14 specification from 3GPP (3rd Generation Partnership Project). It is blazing fast — supporting speeds up to 1.6Gbps in the downlink (Cat 19), and up to 150 Mbps in the uplink. Beyond LTE, it offers support for LTE/LTE DSDS (dual SIM, dual standby), which allow the XMM7660 modem to be roaming on two different LTE networks at the same time — without duplicating modem hardware. It also supports LAA (Licensed Assisted Access) as well as CBRS (Citizen Broadband Radio Service) shared spectrum to enhance flexibility and throughput options. The modem’s architecture is optimized to provide these services, while also ensuring in-device coexistence.

This modem was designed with the global manufacturer in mind. Not only does it support six modes of operation, it also provides 7x Carrier Aggregation for downlink of five non-contiguous bands up to 140MHz as well as integrating 4 mode GNSS with GPS, Galileo, GLONASS, and BeiDou positioning systems for worldwide satellite navigation support.

The XMM 7660 transceiver offers world-class band density—supporting more than 45 bands with a very large number of Carrier Aggregation combinations simultaneously in a single SKU for true global mobile coverage. It is a competitive solution for device manufacturers looking to quickly design and launch LTE devices in multiple market segments and geographies worldwide, and a strong addition to Intel’s broad portfolio of connectivity solutions.

Technical Specifications

Baseband Intel® X-GOLD™ 766 baseband
Transceiver Intel® SMARTi™ 8 RF transceiver
Standards & Performance
  • 3GPP Release 14
  • LTE FDD/TDD 1.6 Gbps/225 Mbps
  • LAA support
  • TD-SCDMA 2.8/2.2 Mbps
  • DC-HSPA+ Cat 24, 42 Mbps
  • GNSS – 4 mode
Transceiver Capabilities
Carrier Aggregation LTE FDD/TDD/Hybrid DL 7CA UL 2CA
Modulation LTE UL-64QAM; DL-256QAM
4x4 MIMO
RF Bands More than 45 LTE bands simultaneous; including 3.5GHz/5GHz
SIM Support LTE/LTE Dual SIM Dual Standby (DSDS)



英特尔® 技术的功能和优势取决于系统配置,可能需要启用硬件、软件或激活服务。随着系统配置的变化,性能也会发生变化。没有任何产品或组件能够做到绝对安全。请咨询您的系统制造商或零售商,或访问 https://www.intel.cn 获取更多信息。