Conventional products need to make trade-offs between size and robustness, resulting in compromises in the end product design. To solve this problem, Intel has introduced the Intel® SMARTi™ UE2p transceiver: the world's first RF transceiver with an integrated 3G power amplifier. This revolutionary incorporation of the power amplifier into the transceiver enables a tiny modem size for the Intel® ...XMM™ 6255 chipset. The high degree of integration also allows built-in protection circuits for the transceiver, making it robust in tough operating conditions while simultaneously reducing BOM cost. The antenna isolator provides excellent real-world performance: Intel® SMARTi™ UE2p transceiver stays connected in challenging network conditions and provides manufacturers the flexibility to design unconventional form factors. When smart devices are paired with big data analysis, the user experience can be improved to provide a seamless and immersive environment while extracting greater value from the data generated. The Intel® XMM™ 6255 chipset with Intel® SMARTi™ UE2p transceiver provides the connected foundation to unlock the value of the Internet of Things in a small, robust package that is easy to apply to your breakthrough device.