This document provides guidelines for the design of thermal and mechanical solutions for the Intel® Xeon® processor 7500 series and the Intel® Xeon® processor E7-8800/4800/2800 product families. Both processors are compatible with the LGA1567 Socket (Chapter 2) and the ILM (Chapter 3). Both processors adhere to... the same thermal specifications found in the Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 (see Table 1-1, “Reference Documents”). Thermal solutions designed for the Intel Xeon processor 7500 series will also be compatible with Intel Xeon processor E7-8800/4800/2800 product families (Chapter 4). The components described in this document include: • The processor thermal solution (heatsink) and associated retention hardware• The LGA1567 socket, Independent Loading Mechanism (ILM) and back plate
The goals of this document are:
• To assist board and system thermal mechanical designers • To assist designers and suppliers of processor heatsinks
Thermal profiles and other processor specifications are provided in Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1.