1.6. MAX 10器件每种封装的I/O资源
| 器件 | 封装 | |||
|---|---|---|---|---|
| 类型 | M153 153-pin MBGA |
U169 169-pin UBGA |
E144 144-pin EQFP |
|
| 尺寸 | 8 mm × 8 mm | 11 mm × 11 mm | 22 mm × 22 mm | |
| 球间距 | 0.5 mm | 0.8 mm | 0.5 mm | |
| 10M02 | 112 | 130 | 101 | |
| 10M04 | 112 | 130 | 101 | |
| 10M08 | 112 | 130 | 101 | |
| 10M16 | — | 130 | 101 | |
| 10M25 | — | — | 101 | |
| 10M40 | — | — | 101 | |
| 10M50 | — | — | 101 | |
| 器件 | 封装 | ||||||
|---|---|---|---|---|---|---|---|
| 类型 | V36 36-pin WLCSP |
V81 81-pin WLCSP |
U324 324-pin UBGA |
F256 256-pin FBGA |
F484 484-pin FBGA |
F672 672-pin FBGA |
|
| 尺寸 | 3 mm × 3 mm | 4 mm × 4 mm | 15 mm × 15 mm | 17 mm × 17 mm | 23 mm × 23 mm | 27 mm × 27 mm | |
| 球间距 | 0.4 mm | 0.4 mm | 0.8 mm | 1.0 mm | 1.0 mm | 1.0 mm | |
| 10M02 | 27 | — | 160 | — | — | — | |
| 10M04 | — | — | 246 | 178 | — | — | |
| 10M08 | — | 56 | 246 | 178 | 250 | — | |
| 10M16 | — | — | 246 | 178 | 320 | — | |
| 10M25 | — | — | — | 178 | 360 | 380 | |
| 10M40 | — | — | — | 178 | 360 | 500 | |
| 10M50 | — | — | — | 178 | 360 | 500 | |