FBDIMM and AMB Validation Process

The objective of the Intel® validation program is to verify compliance to the industry specification and the Intel specification addendum for AMB and FBDIMM. This program also shows functionality of modules and its components in Intel® reference systems, so as to provide a guideline for memory compatibility with Intel® chipsets. This validation will be performed by an approved lab on a sample of modules and is intended to demonstrate supplier design and manufacturing capability. The validation process uses standardized procedures and methodologies documented in the Intel validation specification for AMB and FBDIMM. The procedure is not intended to replace the OEMs' qualification process.

Validation process overview

FBDIMM & AMB validation
Validation Tests AMB Validation FBDIMM Validation
Functional Memory Stress Test @ Process, Temp, and Voltage corners at platform level Yes Yes
Power Management Tests (Power and Reset cycling) Yes Yes
Functional Memory Stress @ Temp & Voltage Corners at CTC level Yes Yes
MD Screen & SPD check Yes Yes
AMB Temp Control & Accuracy Yes NA
IDD Check Yes NA
Protocol Test Yes NA
Thermal Resistance NA Yes
Signal Integrity – Serial link interface Yes NA
Signal Integrity – DRAM interface NA Yes
Transparent Mode Yes NA
AMB Power Yes NA
CRC Injection Yes NA
AMB Interoperability Yes NA

Intel specification addendum for AMB/FBDIMM

AMB/FBDIMM compliance sheet

Approved test labs

For a list of approved test labs, please refer to the appropriate validation results page.

Validation results

Additional information: 1



1. 验证结果 法律声明 本测试报告按“原样”提供,不含任何担保,包括对适销性、特别用途适用性的担保,或由任何建议、规范或抽样衍生的担保。 本文档提供的信息均与英特尔® 产品相关。本文档或通过英特尔产品的销售都不授予明示或暗示的,以禁止翻供或其它方式,对任何知识产权的许可。? 除相关产品的英特尔销售条款与条件中列明之担保条件以外,英特尔公司不对销售和/或使用英特尔产品作出任何其它明确或隐含的担保,包括对适用于特定用途、适销性,或不侵犯任何专利、版权或其它知识产权的担保。英特尔产品并非设计用于医疗、救生或延长生命应用领域。 英特尔保留在不另行通知的情况下随时更改其测试规格的权利。 硬件供应商单独对他们产品的设计、销售和功能负责,包括任何相关的产品侵权和产品质保责任。