Solution Brief: See how Daikin Applied integrates Intel® IoT Gateways into HVAC systems to improve building performance and lower operating costs.
Solution Brief: See how Daikin Applied integrates Intel® IoT Gateways into smart HVAC systems to lower operating costs and improve building performance, keeping building managers happy and tenants comfortable.
Solution Brief: The Internet of Things can help property owners increase profitability with building networks that manage HVAC, security, and more.
Solution Brief: With intelligent building networks capable of simultaneously monitoring and managing HVAC, security, lighting, analytics, and more, the Internet of Things can help commercial property owners increase profitability and revenues.
Brief: Hitachi Visualization Platform* uses Intel® technology to boost real-time intelligence, situational awareness, and investigative capabilities.
Brief: The Hitachi Visualization Platform* (HVP*) uses Intel® technologies in IoT to give public safety and law enforcement agencies real-time insights that enhance situational awareness—as well as investigative capabilities—when an incident occurs.
Solution Brief: KMC Controls uses the Internet of Things to offer cloud-connected building automation, unifying operations across multiple locations.
Solution Brief: KMC Controls uses the Internet of Things to offer a secure, scalable, cloud-connected building automation platform that can unify operations across multiple locations, with deeper integration to improve business operations.
Solution Brief: Yoga Systems connects smart homes to manage security, electronics, and thermostats simultaneously with the Internet of Things.
Brief: Yoga Systems connects automated homes via smartphone to networks that enable users to manage home security, electronics, and thermostats simultaneously using the Internet of Things, which helps smart home service providers increase revenues.
采用英特尔® 通信芯片组 89xxCC 系列的第四代智能英特尔® 酷睿™ 处理器均采用 3D 三栅极晶体管的行业领先的 22 纳米制程技术制造。
采用移动式英特尔® QM87 和 HM86 芯片组的第五代智能英特尔® 酷睿™处理器是一款结合了一个面向空间和功率受限的应用的一个 64 位、多核处理器和平台控制器中枢的低功耗、多芯片封装。