Wind River Simics* full system simulation technology builds virtual systems even before hardware is available, reducing time to market and costs.
Wind River Simics* full system simulation technology allows developers, architects, and engineers to build and use a virtual system even before hardware is available, reducing time to market and development costs.
Intel® BLDK creates customized initialization firmware solutions for embedded platforms, optimizing systems and reducing development time.
Intel® BLDK enables developers to create customized initialization firmware solutions for embedded Intel® processor-based platforms, optimizing systems while reducing development time and BOM costs.
Sarma Vrudhula of Arizona State University presents research on multi-core processor performance optimization under thermal constraints. (Apr. 2010)
Product Brief: The Intel® Q57/3450 Express Chipset provides graphics, security, and manageability for embedded applications. (v.2, Dec. 2009)
Product Brief: The Intel® Q57/3450 Express Chipset provides advancements in graphics, security, and always-available manageability for embedded computing ideal for industrial control and automation, retail, gaming, and print imaging. (v.2, Dec. 2009)
Product Brief: The Intel® Xeon® processor 3400 series has quad-core processing and intelligent performance capabilities ideal for embedded applications, such as ATMs, gaming, security, and industrial control and automation devices. (v.2, March 2010)
Product Brief: PCIe* I/O reference design and Xilinx development kit offer rapid prototyping and development of embedded and industrial applications.
Learn how Intel® architecture is deployed for industrial factory automation uses such as motion controllers, human machine interfaces, robots, programmable logic controllers, and vision systems.
Thermal Design Guide: Describes thermal characteristics, solutions for Intel® Atom™ processors N450/D410/D510 on the micro Flip Chip Ball Grid Array.
Guide: Intel® Atom™ Processors N450/D410/D510
Product Brief: Product overview, highlights, and features of Intel® Core™2 Duo processors E8400/E7400/E6400/E4300. (v.006, July 2009)
Product Brief: Product overview, highlights, and features of Intel® Core™2 Duo processors E8400/E7400/E6400/E4300 and Intel® Core™ microarchitecture for Embedded Computing. (v.006, July 2009)
Datasheet: Explains the mechanical and thermal specs for the Intel® Core™2 Extreme processor QX9000 and Quad Q9000/Q8000 series. (v.010, Aug. 2009)
Datasheet: Explains the electrical, mechanical, and thermal specifications for the Intel® Core™2 Extreme processor QX9000 series and Intel® Core™2 Quad processor Q9000/Q8000 series. (v.010, Aug. 2009)