2011 年规范更新： 英特尔® 至强™ 处理器 5500 系列、 勘误表、规范说明和更改。
This document is a compilation of errata, specification clarifications, and changes. It is intended for hardware system manufacturers and software developers of applications, operating systems, and tools.
Note: Describes use of the thermal test vehicle for the Intel® Xeon® processor 5600/5500 series and provides power through land/pad. (v.1a, Aug. 2007)
App Note: Describes how to use the thermal test vehicle for the Intel® Xeon® processor 5600/5500 series to test thermal solutions and provides power through land/pad, test board, resistance estimates and correction offset details. (v.1a, Aug. 2007)
White Paper: Outlines next gen Intel® microarchitecture Nehalem benefits: scalability, power efficiency, and performance. (v.001, Apr. 2008)
White Paper: Nehalem introduction outlines the benefits of next generation Intel® microarchitecture, including dynamic and design scalability, greater power efficiency at any power envelope, and performance improvement features. (v.001, Apr. 2008)