很抱歉，此 PDF 仅供下载
Intel® EP80579 Integrated Processor Product Line: Thermal GuideThe power dissipation required for electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Describe the thermal and mechanical specifications for Intel® EP80579 Integrated Processor product line• Describe reference solutions that meet the Intel® EP80579 Integrated Processor product line’s thermal and mechanical specificationsRead the full Intel® EP80579 Integrated Processor Product Line Thermal Design Guide.
下载 PDF 文档
Discusses Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.
Intel® Xeon® processors provide power savings, scalability performance, integration, and more.
Learn how intelligent digital advances and signage solutions enhance shopper experience.
Demos digital signage innovations: interactive screens, remote management, and video analytics.
Telecommunications computing architecture for industrial and military use. (v.1, Feb. 2011)