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Intel® Communications Chipset 89xx Series: Design GuideIntroductionPower dissipation requirements for electronic components have risen with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Describe the thermal and mechanical specifications for the Intel® Communications Chipset 89xx Series.• Describe reference solutions that meet the thermal and mechanical specifications of the Intel® Communications Chipset 89xx Series.Read the full Intel® Communications Chipset 89xx Series Design Guide.
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