Intel® 5400 Chipset Memory Controller Hub: Thermal Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or
passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 5400
Chipset
• Describe reference thermal solutions that meet the specifications of the Intel® 5400 Chipset
Properly designed thermal solutions provide
adequate cooling to maintain the Intel® 5400 Chipset case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient
temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the Intel® 5400 Chipset case temperature
at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the
functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The simplest and most
cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When
additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can
be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® 5400 Chipset
component only. For thermal design information on other chipset components, refer to the respective component TMDG. For the PXH, refer to the Intel® 6700PXH 64-
bit PCI Hub Thermal/Mechanical Design Guidelines. For the Intel® 631 ESB/632 ESB I/O Controller Hub, refer to the Intel® 631 ESB/632 ESB I/O Controller Hub
Thermal/Mechanical Design Guidelines.
Read the full Intel® 5400
Chipset Memory Controller Hub Thermal Guide.
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Intel® 5400 Chipset Memory Controller Hub: Thermal Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or
passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 5400
Chipset
• Describe reference thermal solutions that meet the specifications of the Intel® 5400 Chipset
Properly designed thermal solutions provide
adequate cooling to maintain the Intel® 5400 Chipset case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient
temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the Intel® 5400 Chipset case temperature
at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the
functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The simplest and most
cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When
additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can
be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® 5400 Chipset
component only. For thermal design information on other chipset components, refer to the respective component TMDG. For the PXH, refer to the Intel® 6700PXH 64-
bit PCI Hub Thermal/Mechanical Design Guidelines. For the Intel® 631 ESB/632 ESB I/O Controller Hub, refer to the Intel® 631 ESB/632 ESB I/O Controller Hub
Thermal/Mechanical Design Guidelines.
Read the full Intel® 5400
Chipset Memory Controller Hub Thermal Guide.
